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Showing 1 to 6 of 6 for “"thermomechanical reliability"”.
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A study of the thermomechanical reliability of solder joints in surface mount electronics technology
… of high-density products, the mechanical reliability of small component solder joints has become critical. The criticality increases with operations at elevated temperature and harsher ambient conditions. Severe conditions include vibration and shock which under-the-bonnet automotive …
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Thermomechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging
… porosity with the potential for high reliability under high temperature applications. We also investigated the effects of a large temperature cycling range on the reliability of direct bonded aluminum (DBA) substrate. DBA substrates with different metallization were thermally cycled …
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Gallium nitride high electron mobility transistors in chip scale packaging: evaluation of performance in radio frequency power amplifiers and thermomechanical reliability characterization
… of thermal cycles to failure as required in high reliability industrial systems, the devices under test require significant thermal parameter derating to levels on the order of 50%.
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Modeling, design, fabrication and reliability characterization of ultra-thin glass BGA package-to-board interconnections
… lengths, higher component densities and system reliability enabled by the tailorable coefficient of thermal expansion (CTE), high dimensional stability and surface smoothness, outstanding electrical properties and low-cost panel-level processability of glass. The research objectives are to …
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Design and Analyses of a Dimple Array Interconnect Technique for Power Electronics Packaging
… materials, electrical and thermal performance, reliability, and the fabrication process of the DAI. It was found that due to the use of solder material, the current handling capability and thermal management of Dimple Array interconnected devices are significantly better than those using wire …
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Investigation of qualification methods for electric machines in urban air mobility application
Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2022-11-15 without embargo terms