Global ETD Search
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Showing 1 to 10 of 10 for “"thermo-mechanical stress"”.
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Thermo-mechanical stress measurement and analysis in three dimensional interconnect structures
… CTE mismatch between Silicon and Copper, thermal stresses are induced by various thermal histories from the device processing, and they have caused serious concerns regarding the thermal-mechanical reliability. Firstly, a semi-analytic approach is introduced to understand stress distributions in …
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Nonlinear heat transfer and thermo mechanical stress analysis using finite elements.
… numerical procedures for the heat transfer and thermo-mechanical analysis of sol id continua. Steady state conduction heat transfer is developed as a particular case of the general field equation. Internal heat generation and the boundary conditions of specified temperatures, flux, convection. …
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Thermo-mechanical stress relief analysis in PMMA and 6000 series aluminum
Stress relief of materials produced in bulk is a key part of the manufacturing process. The most common kinds are either thermal or mechanical and are commonly applied to commercial metal alloys. A third type, thermo-mechanical, utilizes thermal gradients to induce residual stresses of an equal and …
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Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress
… power module with low thermal impedance and thermo-mechanical stress for high density integration of power electronics systems. With the development semiconductor technology, the heat flux generated in power device keeps increasing. As a result, more and more stringent requirements were …
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Development of Bi-Directional Module using Wafer-Bonded Chips
… structure, however, induces more than twice the thermo-mechanical stress in a single-layer structure. Compressive posts have been developed and integrated into the double-sided module to reduce the stress to a level acceptable by silicon dice. For a 14 mm x 21 mm module carrying 6.6 mm x 6.6 mm …
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Design, Fabrication and Testing of Conformal, Localized Wafer-level Packaging for RF MEMS Devices
… for Radio-Frequency (RF) Micro- Electro-Mechanical (MEMS) devices, such as resonators and switches. These devices require application specific packaging to facilitate their integration, provide protection from the environment, and control interactions with other circuitry. In order to …
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A layer tension loss and cure model for filament wound composites
… accomplishment involved coupling FWCURE with a thermo-mechanical stress simulation program called WACSAFE. When combined, the coupled program forms an improved comprehensive structural model which characterizes the thermal, chemical, physical, and mechanical processes occurring during winding …
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Integrated Thermal Management Strategies for Embedded Power Electronic Modules
… guidelines for IPEMs based on both thermal and thermo-mechanical stress considerations. Specifically, a commercially available finite element package is used to create a 3D geometric layout of the electronic module. The baseline finite element numerical model is validated using bench-top wind …
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Planar metallization failure modes in integrated power electtonics modules
… which is a technology involving electrical, mechanical, material, and thermal issues. By processing high dielectric materials, magnetic materials, or silicon chips using compatible manufacturing procedures, and by carefully designing structures and interconnections, we can realize the …
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Unlocking SiC MOSFET Switching Performance Through Packaging and Instrumentation
Electrical energy conversion is vital to the distribution and use of electricity. With the increased use of renewable energy sources and the move to cleaner electrified transport methods, the demands of power electronic converters and inverters continue to increase. A major component in any power …