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Showing 1 to 2 of 2 for “"thermo-mechanical simulations"”.
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A Double-Sided Stack Low-Inductance Wire-Bondless SiC Power Module with a Ceramic Interposer
… 1MHz is achieved after optimization. Thermal and thermo-mechanical simulations were also conducted to evaluate the thermal performance and mechanical stress of the proposed module structure. </p> <p>The fabrication process flow of the 3-D wire bondless module is developed and presented. The …
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Thermo-mechanical Analysis of a Custom PCB-DBC Hybrid Package for a (650 V, 150 A) e-GaN HEMT
… failure or reliability. With thermally generated mechanical fatigue a consistent cause of electronics failure, it must be investigated for the design to move beyond the prototyping phase. Thermo-mechanical fatigue failure is the brittle fracture of bonds caused by thermally induced warpage. The …