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Showing 1 to 1 of 1 for “"thermally anistropic composite heat spreasders"”.

  1. Enhancement of Nucleate Boiling on Rough and Dimpled Surfaces with Application to Composite Spreaders for Microprocessors Immersion Cooling

    … of PF-5060 dielectric liquid on uniformly heated, 10 x 10 x 1.6 mm rough and dimpled Cu surfaces. Fabricating these surfaces is cost effective and scalable, making them suitable for immersion nucleate boiling cooling of high powered microprocessors requiring heat spreaders of different …

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