Global ETD Search

Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.

Results

Showing 1 to 6 of 6 for “"thermal interface material (TIM)"”.

  1. Wear-resistant thermal interface material (TIM) for quad/octal small form factor pluggable (QSFP/OSFP) modules

    Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2027-08-01

    uiuc Repository record for Wear-resistant thermal interface material (TIM) for quad/octal small form factor pluggable (QSFP/OSFP) modules (opens in a new tab)

  2. Convection and Flow Boiling in Microgaps and Porous Foam Coolers

    … component and which eliminates the problematic thermal resistance of the commonly-used thermal interface material (TIM), is examined. The single phase heat transfer and pressure drop results of water are used to validate a detailed numerical model and, together with the convective FC-72 data, …

    maryland Repository record for Convection and Flow Boiling in Microgaps and Porous Foam Coolers (opens in a new tab)

  3. Characterizing the Thermal Behavior of Pyrolytic Graphite Sheets (PGS) at Low Interface Pressures

    … has led the Navy to pursue the design of a dry interface liquid cooling system to cool the iPEBB. This means that no liquid can cross the boundary of the iPEBB and thus the cooling system must be separate. In this thesis, an integral portion of the dry interface cooling solution, the thermal

    mit Repository record for Characterizing the Thermal Behavior of Pyrolytic Graphite Sheets (PGS) at Low Interface Pressures (opens in a new tab)

  4. System Design, Fabrication, and Characterization of Thermoelectric and Thermal Interface Materials for Thermoelectric Devices

    … endeavors have been made to design and fabricate materials with a higher dimensionless thermoelectric figure of merit (ZT), as well as to optimize the device structure and packaging to manage heat more effectively. When evaluating candidate thermoelectric materials, one must accurately …

    vt Repository record for System Design, Fabrication, and Characterization of Thermoelectric and Thermal Interface Materials for Thermoelectric Devices (opens in a new tab)

  5. Packaging of Enhancement-Mode Gallium Nitride High-Electron-Mobility Transistors for High Power Density Applications

    … concern with GaN HEMTs comes from their lower thermal conductivity and smaller die size. The HEMTs generally have a higher heat flux density, and accordingly, demand better heat dissipation. Thus, innovations are needed for making GaN HEMT packages with low parasitic inductances and higher …

    vt Repository record for Packaging of Enhancement-Mode Gallium Nitride High-Electron-Mobility Transistors for High Power Density Applications (opens in a new tab)

  6. De-risking thermal management challenges in automotive vehicles: oil circulation and thermal contact resistance

    Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2027-05-01

    uiuc Repository record for De-risking thermal management challenges in automotive vehicles: oil circulation and thermal contact resistance (opens in a new tab)