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Showing 1 to 3 of 3 for “"thermal fin"”.

  1. Thermal designs, models and optimization for three-dimensional integrated circuits

    … interconnects. Despite numerous advantages, thermal management is the biggest bottleneck to expanding the applications of this device stacking technology. In addition to implementing the thermal-aware designs of existing methodologies, it is necessary to implement new features to dissipate …

    uiuc Repository record for Thermal designs, models and optimization for three-dimensional integrated circuits (opens in a new tab)

  2. A certified reduced basis approach to PDE-constrained optimization

    … expensive high-dimensional PDE solvers (e.g., finite element) with lower-dimension surrogate models. This work builds on the reduced basis (RB) method, a model reduction method that allows efficient and reliable reduced order approximations for a large class of parametrized PDEs. Traditionally, …

    mit Repository record for A certified reduced basis approach to PDE-constrained optimization (opens in a new tab)

  3. A reduced-basis method for input-output uncertainty propagation in stochastic PDEs

    … method has been devised for problems where an affine parametrization of the PDE in terms of the uncertain input parameters may be obtained. This particular structure enables us to seek an offline-online computational strategy to economize the output evaluation. Indeed, the offline stage …

    mit Repository record for A reduced-basis method for input-output uncertainty propagation in stochastic PDEs (opens in a new tab)