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Showing 1 to 2 of 2 for “"temperature cycling test"”.
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Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
… was evaluated using accelerated temperate cycling and adhesion tests. The interfaces of the triple-stacked solder joints were examined using scanning electron microscopy (SEM) and energy dispersive X-ray analysis (EDX) for the integrity of the joint. Acoustic microscopy imaging …
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Planar metallization failure modes in integrated power electtonics modules
… size and increasing power density are the latest trends in modern power electronics development. In order to meet the requirements of higher frequency and higher power density in power electronics applications, planar interconnections are utilized to achieve a higher integration level. Power …