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Showing 1 to 1 of 1 for “"tapered Through-Silicon-Via (TSV)"”.
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Numerical Modeling Analysis of Wafer Warpage and Carrier Mobility Change due to Tapered Through-Silicon-Via Geometry
… that vertically stacks multiple layers of silicon chips by Through-Silicon-Vias (TSVs) to enhance the performance of microelectronic devices. The tapered TSV profile can help to overcome the technical difficulties. However, an easily overlooked issue is that tapered TSV can cause wafer …