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Showing 1 to 20 of 47 for “"sputter deposited"”.

  1. biaxial alignment in sputter deposited thin films

    … material flux. Simulating the transport of the sputtered particles through the gas phase, results in the knowledge of this angular spread. Hence, the influence of several deposition parameters on the degree of in-plane alignment could be understood.

    ghent Repository record for biaxial alignment in sputter deposited thin films (opens in a new tab)

  2. Investigations On Rf Sputter Deposited Sicn Thin Films For Mems Applications

    … silicon carbide nitride (a-SiCxNy) were deposited in a RF magnetron sputtering system using a powder pressed SiC target. Films with various compositions were deposited on to silicon substrate by changing the N2/Ar gas ratios during sputtering. Nano-indentation studies were performed to …

    ucf

  3. Adhesion, Residual Stresses and Tribology of Rf Sputter Deposited Titanium Carbide Coatings

    … stress in the coating. The residual stress in sputter deposited TiC films was found to be compressive and could be related to the trapped Ar concentration in the films. The Ar concentration, and hence the compressive stress, increased with decreasing Ar sputtering pressure, P(,Ar), due to the …

    uiuc Repository record for Adhesion, Residual Stresses and Tribology of Rf Sputter Deposited Titanium Carbide Coatings (opens in a new tab)

  4. Magnetic Properties Of Sputter Deposited Fe-based Amorphous Thin Films For Resonator Application

    … Fe80-xMnxB20, and Fe73-xMnxB27 films were deposited on silicon and glass substrates in a DC and RF magnetron sputtering system. Inductive magnetic measurements were performed to investigate the magnetic properties, including induced anisotropy and magnetostriction, of the as-deposited and …

    ucf

  5. Tribology and Micro-Chemistry of Sputter Deposited Composite Coatings on Honed Steel Substrates

    … The primary wear resistant coatings (TiC) were deposited by rf sputtering using a dc substrate bias and the solid lubricant coatings (TiO(,2)) were deposited in an Ar and O(,2) mixed rf glow discharge. Chemically honed steel substrates which consisted of a checkerboard of raised squares …

    uiuc Repository record for Tribology and Micro-Chemistry of Sputter Deposited Composite Coatings on Honed Steel Substrates (opens in a new tab)

  6. Microstructures and mechanical properties of the sputter deposited copper(x) tantalum(1-x) films

    Copper-refractory metal composites/alloys are of interest for aerospace and related applications requiring good thermal conductivity and high strength at elevated temperatures. These materials, due to generally very low mutual solubilities, may allow development of high strength microstructures …

    uiuc Repository record for Microstructures and mechanical properties of the sputter deposited copper(x) tantalum(1-x) films (opens in a new tab)

  7. Low temperature photoluminescence studies on sputter deposited cadmium sulphide/cadmium telluride heterojunctions and solar cells

    … oxide covered soda lime glass using rf-sputter deposition. It was found that the luminescence shifts from being dominated by sub-gap defect mediated emission at lower excitation powers to near band edge excitonic emission at higher excitation powers. The effect of copper (Cu) used in …

    uiuc Repository record for Low temperature photoluminescence studies on sputter deposited cadmium sulphide/cadmium telluride heterojunctions and solar cells (opens in a new tab)

  8. Investigation into the effects of chromium cross-contamination in niobium sputter deposited coatings using a multi-target PVD system.

    … this investigation coatings were co-sputter deposited using a main Nb target power of 8kW and Cr target voltages of 0-350V in increments of 25/50V, (the potential range commonly used to prevent unwanted deposition on unused targets), at a temperature of ~400°C.The subsequent …

    sheffield-hallam Repository record for Investigation into the effects of chromium cross-contamination in niobium sputter deposited coatings using a multi-target PVD system. (opens in a new tab)

  9. Base material electrocatalysts for oxygen cathodes in low temperature acid fuel cells

    … 1.5 M H2SO4 at 20 °C and 70 °C in this work, a sputter-deposited Ni/Ta/C coating on a carbon paper support displayed both very good corrosion resistance and good oxygen reduction activity. A sputter- deposited Cr/Ta/C coating on a carbon cloth support and a C^Cö gas diffusion electrode displayed …

    cambridge Repository record for Base material electrocatalysts for oxygen cathodes in low temperature acid fuel cells (opens in a new tab)

  10. Development of Ti-Si-N and Ta-Si-N as diffusion barriers

    "Sputter deposited Ti-Si-N and Ta-Si-N films with different compositions were fabricated using Ti, Si, TiSi₂, and Ta targets in Ar/N₂ plasmas with a variety of deposition parameters. A fractional factorial design (FFD) method was used to identify the significant deposition variables for the Ti-Si-N …

    must-thes Repository record for Development of Ti-Si-N and Ta-Si-N as diffusion barriers (opens in a new tab)

  11. A scanning tunneling microscopy study of metal films and supported gold particles

    … the surface morphology of Au/Pd films that were sputter deposited onto mica and subsequently sintered in air, as well as equilibrium gold particles formed and supported on graphite. New structures were observed on both the film and particle samples. The surfaces are very rough on the nanometer …

    uiuc Repository record for A scanning tunneling microscopy study of metal films and supported gold particles (opens in a new tab)

  12. Diffusion Barriers/Adhesion Promoters. Surface and Interfacial Studies of Copper and Copper-Aluminum Alloys

    … promoter. The behavior of copper sputter-deposited onto sputter-cleaned tantalum nitride is investigated. The data show that copper growth on tantalum nitride proceeds with the formation of 3-D islands, indicating poor adhesion characteristics between copper and Ta0.4N. …

    unt Repository record for Diffusion Barriers/Adhesion Promoters. Surface and Interfacial Studies of Copper and Copper-Aluminum Alloys (opens in a new tab)

  13. Study of Interactions Between Diffusion Barrier Layers and Low-k Dielectric Materials for Copper/Low-k Integration

    … nitride (TiN) are prepared by DC magnetron sputtering and metal-organic chemical vapor deposition (MOCVD), respectively. Surface analytical techniques, such as X-ray photoelectronic spectroscopy (XPS), transmission electron microscopy (TEM), and atomic force microscopy (AFM) are employed. Ta …

    unt Repository record for Study of Interactions Between Diffusion Barrier Layers and Low-k Dielectric Materials for Copper/Low-k Integration (opens in a new tab)

  14. Study of residual stress in a thin platinum layer by means of nondestructive x-ray diffraction

    Resistance thermometers are often made of thin, sputter-deposited platinum layers on a corundum substrate. Since such thermometers are usually exposed to extreme temperatures, residual stress is building up at the Pt-Ah03 interface and can possibly damage the layer. Therefore, the stress in the …

    cape-town Repository record for Study of residual stress in a thin platinum layer by means of nondestructive x-ray diffraction (opens in a new tab)

  15. Microstructure, residual stress, and mechanical properties of thin film materials for a microfabricated solid oxide fuel cell

    The microstructure and residual stress of sputter-deposited films for use in microfabricated solid oxide fuel cells are presented. Much of the work focuses on the characterization of a candidate solid electrolyte: Yttria Stabilized Zirconia (YSZ). Stress and structure of reactive RF sputtered YSZ …

    mit Repository record for Microstructure, residual stress, and mechanical properties of thin film materials for a microfabricated solid oxide fuel cell (opens in a new tab)

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