Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
Results
Showing 1 to 20 of 52 for “"soldering"”.
-
Mathematical and physical modeling of flip-chip soldering processes
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.
-
Slide-audio vs. slide-booklet media for teaching soldering techniques
Call number: LD2668 .T4 1968 R433
-
Slide-audio vs. slide-booklet media for teaching soldering techniques
Call number: LD2668 .T4 1968 R433
-
Study of Titanium based Composite Coatings for Resistance against Molten Aluminium Soldering on H13 Tool Steel
… of the coatings was assessed in terms of Al soldering, liquid metal corrosion resistance, thermal shock resistance and wear resistance. In an immersion test, the coated specimens were dipped into molten Al at a temperature of 700 ± 10 °C for different intervals of time. The performance of the …
-
Characterization of FR-4 Printed Circuit Board Laminates Before and After Exposure to Lead-free Soldering Conditions
The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as Sn/Ag/Cu has resulted in higher temperature exposures during assembly compared with traditional eutectic Sn/Pb solders. The knowledge of possible variations in the PCB laminate material properties due …
-
A robotic hand that utilizes ergonomic evaluation as feedback to improve human robot collaboration in soldering applications
… vise to the "helping hands" commonly used for soldering. However, these tools do not measure up to their human counterparts. They cannot adjust the position or orientation of the workpiece to suit a particular task which can cause workers to maintain unhealthy postures that are detrimental to …
-
LCD, low-temperature soldering and compound semiconductor : the sources, market, applications and future prospects of indium in Malaysia
… and increasing demands from LCD, low-temperature soldering and compound semiconductors have stimulated the indium price increase dramatically. Traditionally, indium is refined as a by-product of zinc refining. However, this type of indium extraction method is expected to last for the next 10-20 …
-
Design of educational engineering projects fabricated with the laser-cutter and CNC wire bender
… of this design project is the creation of a soldering iron holder made using components bent on the DiWire. Many design iterations are carried out before settling on the final design and material choice. The soldering iron holder is then incorporated into a larger electrical engineering …
-
Thermomechanical Stress in Solar Cells and Modules: A Finite Element Modelling and Experimental Investigation
… in Multi-Busbar (MBB) tiled modules after soldering and lamination. The impact of cell overlapping in modules and the selection of solders on maximum stress and stress distribution of MBB modules was investigated. Simulation results predicted that a maximum 1st principal stress of up to …
-
Analysis of Direct-Soldered Power Module / Heat Sink Thermal Interface for Electric Vehicle Applications
… Mounting a power module by directly soldering it onto a heat sink can significantly reduce the thermal impedance at the module / heat sink interface, as compared to the conventional method of bolting the two together with a thermal grease or some other interface materials in between. …
-
Design of a high performance liquid-cooled lithium-ion battery pack for automotive applications
… cell. A novel design is proposed, implementing soldering the negative terminal of electroplated 18650 battery cells directly to a metal core printed circuit board material as the critical cell-to-water interface that provides high thermal conductivity while maintaining electrical isolation. Cold …
-
Analysis of surface mount technology solder joints
… is the occurrence of tombstoning; that is after soldering only one end of the component is soldered while the other is lifted up, assuming a position like a tombstone. The initiation of tombstoning during reflow was analysed based on the forces acting on the component. A model was developed to …
-
Fabrication Refinements of Advanced Packaging Techniques for Medium-Voltage Wirebond-less Multi-Chip Power Modules
… posts to disconnect altogether. Additionally, soldering MCPMs involves a large thermal mass that the soldering reflow profile from a datasheet does not account for. Ultimately, these fabrication concerns can result in misalignment or disconnected post interconnects to the top substrate. Post …
-
An Experimental Investigation on the Effects of Web-Based Instruction/Training on Cognitive and Psychomotor Learning
… group received 30 minutes of instruction on "Soldering a Circuit Board." The researcher chose this content subject because it involved both cognitive and psychomotor objectives, which suited the purpose of this study. It was hypothesized that there would be no significant difference between …
-
The effect of alloying element in lead-free solders on intermetallics growth with enimag surface finish
… solders on interfacial reaction during reflow soldering between Sn-2.5Ag (SA25), Sn-2.5Ag-0.5Cu-1.0Bi (SACB25051), Sn�2.0Ag-0.7Cu-3.0Bi (SACB20073) and Sn-3.4Ag-4.8Bi (SAB3448) with an ENIMAG surface finish. Solder balls with sizes of 500μm diameters were used. All samples were subjected to an …
-
Lead-free solders for high-reliability applications: high-cycle fatigue studies
… reduced by elevated temperatures and by soldering to nickel substrates. In order to investigate these results, a number of techniques are employed. In addition to extensive fractography, the damping capacity of the solders is investigated and a scanning acoustic microscope is used in …
-
Cleaning process development and optimization in the surface mount assembly line of power modules
… (PCB) assemblies after the process of reflow soldering. This thesis details the development of an optimized cleaning process that effectively removes solder flux residue from PCB assemblies. The first stage of this study involves the experimental validation of root cause of process …
-
Study of intermetallic compound layer formation, growth and evaluation of shear strength of lead-free solder joints
… a concern with the introduction of new lead-free soldering. Other factors which are known to affect solder joint reliability include the bonding strength, the voiding percentage in joints, the size of the voids and their location within the joint. The work reported in this thesis on formation and …
Page 1 of 3