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Showing 1 to 1 of 1 for “"silver-sintering die-attach"”.
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Low Pressure and Short-Time Silver-Sintering for Power Modules
Silver-sintering has become one of the main chip interconnect technologies in wide bandgap (WBG) semiconductor power modules due to its excellent thermal conductivity, high temperature stability and mechanical reliability. However, the traditional silver sintering process generally has the problems …