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Showing 1 to 10 of 10 for “"silver sintering"”.
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Low Pressure and Short-Time Silver-Sintering for Power Modules
Silver-sintering has become one of the main chip interconnect technologies in wide bandgap (WBG) semiconductor power modules due to its excellent thermal conductivity, high temperature stability and mechanical reliability. However, the traditional silver sintering process generally has the problems …
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Reliability Evaluation of Large-Area Sintered Direct Bonded Aluminum Substrates for Medium-Voltage Power Modules
… focus will be given to the utilization of silver sintering as a bonding method for high temperature, high density power modules. Nano-silver paste and preform will be examined in detail as enabling technologies for a new generation of power electronics. To accomplish this task, analysis and …
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Design, Fabrication, and Packaging of Gallium Oxide Schottky Barrier Diodes
… Ga2O3 SBDs are fabricated and packaged using silver sintering as the die attach. The sintered silver joint has higher thermal conductivity and better reliability as compared to the solder joint. The metal finish on the anode and cathode has been optimized for silver sintering. Large-area, …
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Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection
… relationships of low-temperature sintering of nanoscale silver pastes. The nanoscale silver pastes have been formulated by adding organic components (dispersant, binder and thinner) into nano-silver particles. The selected organic components have the nano-particle polymeric …
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A diffusion-viscous analysis and experimental verification of the drying behavior in nanosilver-enabled low-temperature joining technique
The low-temperature joining technique (LTJT) by silver sintering is being implemented by major manufacturers of power electronics devices and modules for bonding power semiconductor chips. A common die-attach material used with LTJT is a silver paste consisting of silver powder (micron- or …
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Fabrication Refinements of Advanced Packaging Techniques for Medium-Voltage Wirebond-less Multi-Chip Power Modules
… interconnects. For this module, encapsulated, silver-sintered substrates reduce the peak electric field within the package, improving the partial discharge inception voltage to meet insulation requirements. It is essential to have a uniform bondline between the substrates to achieve all bond …
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Field-Grading in Medium-Voltage Power Modules Using a Nonlinear Resistive Polymer Nanocomposite Coating
… techniques, including double-sided cooling and silver-sintering. Prototypes of 10-kV and 20-kV silicon carbide diode modules confirmed the practicality and efficacy of the polymer nanocomposite. The insulation enhancements observed at the module level mirrored those at the substrate level. …
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Electrical and Thermal Characterizations of IGBT Module with Pressure-Free Large-Area Sintered Joints
Silver sintering technology has received considerable attention in recent years because it has the potential to be a suitable interconnection material for high-temperature power electronic packaging, such as high melting temperature, high electrical/thermal conductivity, and excellent mechanical …
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Double-Side Cooled 3.3 kV, 100 A SiC MOSFET Phase-Leg Modules for Traction Applications
This thesis presents the development of a double-side cooled 3.3 kV, 100 A SiC MOSFET phase-leg power module for heavy-duty traction applications. Parasitic extraction and thermal simulations of the module showed a parasitic inductance of 2.89 nH and junction temperature of 108.3 °C at a heat flux …
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Design, Fabrication, Characterization, and Packaging of Gallium Oxide Power Diodes
… large-area Ga2O3 diodes are packaged using silver sintering as the die attach. The sintered silver joint has higher thermal conductivity (kT) and better reliability as compared to the solder joint. Due to the low kT of Ga2O3 material, junction-side-cooled (JSC) packaging configuration is …