Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 9 of 9 for “"semiconductor packaging"”.
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ADVANCED STATISTICAL ANALYSIS FOR TAIL-END PROBABILITY PREDICTION AND PERFORMANCE RESPONSE CALCULATION OF SEMICONDUCTOR PACKAGING PRODUCTS WITH A LARGE NUMBER OF INPUT VARIABLES
… capabilities are developed and implemented for semiconductor packaging problems with a very large number of input variables (> 10 input variables). The capabilities are aimed at three critical areas in the semiconductor packaging product development: (1) prediction of tail-end probability (i.e., …
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Technology for Planar Power Semiconductor Devices Package with Improved Voltage Rating
The high-voltage SiC power semiconductor devices have been developed in recent years. They cause an urgent in the need for the power semiconductor packaging to have not only low interconnect resistance, less noise, less parasitic oscillations, improved reliability, and better thermal management, …
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PCB-Based 1.2 kV SiC MOSFET Packages for High Power Density Electric Vehicle On-Board Chargers
… with silicon carbide (SiC) metal oxide semiconductor field effect transistors (MOSFETs) has been proposed as a solution to increase the power densities of power converters in some applications. One such application is electric vehicles (EVs) where the efficiency and weight of the power …
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Novel fibrillar carbon nanotube heat transfer gels with enhanced thermal conductivities
… n-HTFs include: mechanical-frictional damping, semiconductor packaging, thin-films, hydraulic oil lubricant use, thermoelectric power, thermo-sensing, fuel cells, additive-antioxidant-viscosity modifiers, and filtration.
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Double-Sided Liquid Cooling for Power Semiconductor Devices Using Embedded Power Technology
… emphasis of research for this area. Power semiconductors present some of the major challenges for increasing system level power density due to high loss density and interconnection requirements. Advanced cooling schemes, such as double-sided, forced liquid convection or multi-phase flow, …
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Thermal Stability of Al₂O₃/Silicone Composites as High-Temperature Encapsulants
… interest in high-density and high-temperature packaging. There are high-temperature materials such as encapsulants on the market that are claimed for capability of continuous operation at or above 250°C. With an objective of identifying encapsulants suitable for packaging wide-bandgap devices, …
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A Low Temperature Co-fired Ceramic (LTCC) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module
<p>The objective of this dissertation research is to develop a low temperature co-fired ceramic (LTCC) interposer-based module-level 3-D wire bondless stacked power module. As part of the dissertation work, the 3-D wire bondless stack is designed, simulated, fabricated and characterized. The 3-D …
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Evaluation and Analysis on the Effect of Power Module Architecture on Common Mode Electromagnetic Interference
Wide bandgap (WBG) semiconductor devices are becoming increasing popular in power electronics applications. However, WBG semiconductor devices generate a substantial amount of conducted electromagnetic interference (EMI) compared to silicon (Si) devices due to their ability to operate at higher …
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Unlocking SiC MOSFET Switching Performance Through Packaging and Instrumentation
… is the transistor. Advances in wide-bandgap semiconductors such as Gallium Nitride (GaN) and Silicon Carbide (SiC) are leading to improved transistor technologies. These materials allow for smaller transistors with reduced on state resistances and input capacitances, this reduces losses and …