Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 7 of 7 for “"process design kit"”.
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Design-technology Co-optimization for Sub-2 nm Technology Node Based on 2D Materials
… escalating complexity of advanced semiconductor processes, two-dimensional (2D) materials offer promising opportunities when developed through Design-Technology Co-Optimization (DTCO). This thesis presents a comprehensive study of DTCO with a novel framework tailored for 2D material-based …
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Analog integrated photonics
… challenges: (1) managing photonic layout and design of large-scale, complex systems jointly with CMOS driving circuitry, (2) integrating analog optical components in silicon, and (3) integrating photonic light sources in silicon. First, we present a comprehensive VerilogA modeling toolkit for …
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Compact modelling in RF CMOS technology
… to integrated circuit (ICs) computer automatic design (CAD) are the key component of a process design kit (PDK) and the bridge between design houses and foundries. In this work, a novel substrate model is proposed for accurately characterizing the behaviour of RF-MOSFETs with deep n-wells (DNW). …
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Low-Temperature Germanium Waveguides for Mid-Infrared Sensing Applications
… 11.3 µm were modeled and the direct lithography process was refined. Through dose testing and adjustments to the raster direction and pixel resolution, it was found that direct write lithography lacked the resolution required for low-loss waveguides. Scanning electron microscopy (SEM) revealed …
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Design of low power high speed digital vedic multiplier using 13T hybrid full adder
… a 4x4 bit Vedic multiplier has been successfully designed using the combination of Urdhva Triyakbyam Sutras and 13 transistors (13T) hybrid full adder (HFA). The Urdhva Triyakbyam algorithm satisfies the requirement of a fast multiplication operation which reduced large number of partial products …
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Flip Chip testing with a capacitive coupled probe chip.
… works by attaching the chip to a specially designed probe chip instead of the normal packaging. Metal pads on the top layer of the probe chip correspond to lines on the top layer of the chip being tested. These points form a capacitive coupling between the chips, letting the probe chip read …
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Optimized grating coupler designs for integrated photonics
… Photonics Packaging poses. In this context, the design process is a crucial and vital step to overcome the majority of the issues that can potentially arise during the packaging assembly procedure. As a consequence, a single person cannot manage all the aspects behind the design process, but a …