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Showing 1 to 17 of 17 for “"power integrity"”.

  1. Modeling and simulation for signal and power integrity of electronic packages

    … and co-simulation methodologies for signal and power integrity of package and board applications. The dissertation includes 1) the application of the finite element method to the optimization for decoupling capacitor selection and placement on a power delivery network (PDN), 2) the development …

    gatech Repository record for Modeling and simulation for signal and power integrity of electronic packages (opens in a new tab)

  2. Modeling strategies for estimating and suppressing electromagnetic interference and improving power integrity

    … are used to suppress high-frequency noise in power distribution networks. The inductance associated with a mounted decoupling capacitor can vary by 26% depending on characteristics of the printed circuit board. Here, simple and accurate inductance models of 2- and 8-terminal capacitors …

    must-thes Repository record for Modeling strategies for estimating and suppressing electromagnetic interference and improving power integrity (opens in a new tab)

  3. Signal and power integrity analysis of bidirectional DC-DC converters for hybrid energy storage systems with EMI/EMC optimization

    … a broader range of characteristics in terms of power density, energy density and calendar life. A 500W bidirectional synchronous DC-DC converter design is implemented for the active topology of HESS. This thesis examines optimal design principles and practices essential for the printed circuit …

    uoit Repository record for Signal and power integrity analysis of bidirectional DC-DC converters for hybrid energy storage systems with EMI/EMC optimization (opens in a new tab)

  4. Design and analysis of highspeed electronics for electro optical payload of small satellites

    … time incorporating the outcomes of the signal integrity and power integrity analysis in the design. High-speed analysis is an important consideration for high resolution cameras and is often performed on the satellites. This research work aims towards presenting the design and analysis of …

    cape-town Repository record for Design and analysis of highspeed electronics for electro optical payload of small satellites (opens in a new tab)

  5. Circuit model extraction in digital and RD circuits using the partial element equivalent circuit (PEEC) method

    … dissertation discusses four topics relevant to power integrity and design, numerical modeling, and characterization and modeling of MEMS switches"--Abstract, page iv.

    must-thes Repository record for Circuit model extraction in digital and RD circuits using the partial element equivalent circuit (PEEC) method (opens in a new tab)

  6. PI AND EMI ANALYSIS OF 3D IC SYSTEM WITH TSVS AND CO-PACKAGED OPTICS

    … for developing high-capacity, high-density, high-power optical links for data center communications, co-packaged optics is a promising solution. When the three-dimensional (3D) IC and optic engines are integrated into the same package, the design of such systems in terms of signal integrity, power

    must-thes Repository record for PI AND EMI ANALYSIS OF 3D IC SYSTEM WITH TSVS AND CO-PACKAGED OPTICS (opens in a new tab)

  7. Package and PCB solutions for high-speed data link applications

    … channel. Channel loss, signal crosstalk, and power integrity are the important factors affecting the bandwidth of the channel and must be fully understood when designing such high-speed links. Moreover, channel performance optimization requires system level analysis with co-design of different …

    mit Repository record for Package and PCB solutions for high-speed data link applications (opens in a new tab)

  8. Multiphysics modeling and simulation for large-scale integrated circuits

    … the static and dynamic IR-drop analyses of power distribution networks, the thermal-ware high-frequency characterization of through-silicon-via structures, the full-wave electromagnetic analysis of high-power RF/microwave circuits, the modeling and analysis of three-dimensional ICs with …

    uiuc Repository record for Multiphysics modeling and simulation for large-scale integrated circuits (opens in a new tab)

  9. The Dual Use of Power Distribution Networks for Data Communications in High Speed Integrated Circuits

    … method in high speed integrated circuits using power distribution networks (PDNs). The conventional purpose of PDNs in integrated circuits (ICs) is to deliver power to internal nodes of an IC while meeting a level of power integrity. As the power consumption increases for very large scale …

    vt Repository record for The Dual Use of Power Distribution Networks for Data Communications in High Speed Integrated Circuits (opens in a new tab)

  10. Failures caused by supply fluctuations during system-level ESD

    … caused by ESD-induced noise on signal inputs and power nets. Besides radiation, the current injection into the circuit alone can cause these disturbances, especially the sharp current spike of a high amplitude in system-level ESD. The waveform of this current is similar in various ESD test setups. …

    uiuc Repository record for Failures caused by supply fluctuations during system-level ESD (opens in a new tab)

  11. Understanding, modeling, and mitigating system-level ESD in integrated circuits

    … analytic models of rail-clamp circuits used for power-on ESD protection. Simulation models for two common ESD protection elements, diodes and silicon controlled rectifiers (SCR) are presented and evaluated, specifically with regard to the origins of poor voltage clamping. These models can be used …

    uiuc Repository record for Understanding, modeling, and mitigating system-level ESD in integrated circuits (opens in a new tab)

  12. Dynamic power management for computing and communication

    Power management is essential in state-of-the-art many-core processor and system-on-chip designs due to the ever-increasing demand for performance and the diminishing benefits from technology scaling. With more and more integration of processing cores and functional blocks, aggressive power

    uiuc Repository record for Dynamic power management for computing and communication (opens in a new tab)

  13. Linear and Nonlinear Model Reduction for Large-scale Electronic Systems

    L'abstract è presente nell'allegato / the abstract is in the attachment

    poli-torino Repository record for Linear and Nonlinear Model Reduction for Large-scale Electronic Systems (opens in a new tab)

  14. 2X-Thru, 1X-Reflection, and Thru-Line de-embedding: Theory, sensitivity analysis, and error corrections

    "Due to the simplicity of design and measurement, as well as the accuracy of results, the 2X-Thru de-embedding (2XTD), 1X-Reflection de-embedding (1XRD), and Thru-Line de-embedding (TLD) have been replaced the traditional de-embedding algorithms, such as TRL and SOLT. In this dissertation, theory …

    must-thes Repository record for 2X-Thru, 1X-Reflection, and Thru-Line de-embedding: Theory, sensitivity analysis, and error corrections (opens in a new tab)

  15. 3D modeling and integration of current and future interconnect technologies

    … to estimate the circuit performance and signal integrity in the circuit design phase. A full phase simulation for performance estimation of a large-scale circuit not only require a massive computational resource but also need a lot of time to produce acceptable results. The estimation of …

    umkc Repository record for 3D modeling and integration of current and future interconnect technologies (opens in a new tab)

  16. Application of the latency insertion method (LIM) to the analysis of large circuit interconnect networks

    … very large networks such as on-chip signal and power distribution networks. We demonstrate that the LIM has the power and flexibility to handle various types of analysis required at different stages of circuit design. The LIM is particularly suitable for simulations of very large scale linear …

    uiuc Repository record for Application of the latency insertion method (LIM) to the analysis of large circuit interconnect networks (opens in a new tab)