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Showing 1 to 12 of 12 for “"power electronics module"”.
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A multi-scale iterative approach for finite element modeling of thermal contact resistance
… thermal contact resistance. A commercial power electronics module which exhibits both macroscopic surface form and micro scale surface roughness is analyzed using three different macro scale surface models to verify the accuracy of the model and to demonstrate the impact of geometric …
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Describing Integrated Power Electronics Modules using STEP AP210
The software environment for power electronics design is comprised of tools that address many interrelated disciplines including circuits design, physical layout, thermal management, structural mechanics, and electromagnetics. This usually results in a number of separate models that provide various …
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RF Models for Active IPEMs
Exploring RF models for an integrated power electronics module (IPEM) is crucial to analyzing and predicting its EMI performance. This thesis deals with the parasitics extraction approach for an active IPEM in a frequency range of 1MHz through 30MHz. Based on the classic electromagnetic field …
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Integrated Electrical and Thermal Modeling, Analysis and Design for IPEM
… the multidisciplinary design process in power electronics through the integration of existing CAD tools, multidisciplinary modeling and system optimization. Two major benefits are expected from the utilization of the proposed integrated design methodology. Firstly, it will significantly …
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Miniaturization, Packaging, and Thermal Analysis of Power Electronics Modules
High power circuits, those involving high levels of voltages and currents to produce several kilowatts of power, would possess an optimized efficiency when driven at high frequencies (on the order of MHz). Such an approach would greatly reduce the size of capacitive and magnetic components, and …
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Design and Analyses of a Dimple Array Interconnect Technique for Power Electronics Packaging
… thermal and mechanical characteristics for power electronics applications. In the DAI structure, electrical connections onto the devices are achieved by solder bumps formed between the silicon device and arrays of dimples stamped on a metal sheet flex. This research first presents the design …
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Integrated Thermal Design and Optimization Study for Active Integrated Power Electronic Modules (IPEMs)
… is one of many critical tasks in the design of power electronic systems. It has become increasingly important as a result of the introduction of high power density and integrated modules. It has also been realized that higher temperatures do affect reliability due to a variety of physical …
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High Temperature SiC Embedded Chip Module (ECM) with Double-sided Metallization Structure
… a technology for a high temperature integrated power electronics module, for high temperature (e.g those over 200oC) applications involving high density and low stress. To achieve this goal, this study has examined some existing packaging approaches, such as wire-bond interconnects and solder …
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Investigation of High-density Integrated Solution for AC/DC Conversion of a Distributed Power System
With the development of information technology, power management for telecom and computer applications become a large market for power supply industries. To meet the performance and reliability requirement, distributed power system (DPS) is widely adopted for telecom and computer systems, because …
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Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules
… need for the introduction of high reliability power electronics in converting the raw form of electricity into efficient electricity for these applications is uprising. One of the most common failures in power electronics is temperature related failure such as overheating. To address the issue …
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Electrical, Magnetic, Thermal Modeling and Analysis of a 5000A Solid-State Switch Module and Its Application as a DC Circuit Breaker
… The mechanical circuit breaker is widely used in power systems to protect industrial equipment during fault or abnormal conditions. Compared with the slow and high-maintenance mechanical circuit breaker, the solid-state circuit breaker is capable of high-speed interruption of high currents without …
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Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
Circuit assembly and packaging technologies for power electronics have not kept pace with those for digital electronics. Inside those packaged power devices as well as the state-of-the-art power modules, interconnection of power chips is accomplished with wirebonds. Wirebonds in power devices and …