Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
Results
Showing 1 to 6 of 6 for “"power electronics cooling"”.
-
Thermal management of discretized heaters using CuW microchannel heat sinks and FC3283 for laser diode applications
Single-phase cooling using microchannel heat sinks (MCHS) has become a popular approach for overcoming the thermal challenges associated with high-powered microelectronic devices. Thermal management is one of the largest barriers to higher power densities in electronics and frequently limits …
-
Coupling electrolysis and surface patterning to improve onset of nucleate boiling and bubble departure in pool boiling heat transfer
… heater inside the copper block to supply power to the test chip, along with a series of vertically arranged thermocouples to accurately determine the heat flux and surface temperature. Using this setup, pool boiling was first measured for plain silicon, plain gold, and gold microstrip …
-
Design and performance characterization of high power density air-cooled compact condenser heat exchangers
… condenser heat exchangers with exceptional power density performance in excess of 100 W/cm3. This exceptional heat exchanger performance is attributed to the implementation of high-speed compressible air flow in circular microchannels and two-phase condensation flow of refrigerant in …
-
Integrated Thermal Design and Optimization Study for Active Integrated Power Electronic Modules (IPEMs)
… is one of many critical tasks in the design of power electronic systems. It has become increasingly important as a result of the introduction of high power density and integrated modules. It has also been realized that higher temperatures do affect reliability due to a variety of physical …
-
Thermal-hydraulic characterization of single- and two-phase immersion cooling for electronic modules
The continued growth in power density and integration level of electronic systems has created severe challenges for thermal management. High-performance processors, power electronics, and dense printed circuit board (PCB) assemblies routinely dissipate heat fluxes that exceed the capabilities of …
-
Flow Boiling in Meso-Scale Pin-Fin Coldplates
Coldplates are a critical component in various cooling applications, such as cooling of data centers, high-end central processing units (CPUs) and graphics processing units (GPUs), and the thermal management of power electronics. The rising demand for computational resources, high-power-density …