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Showing 1 to 2 of 2 for “"power electronic packaging"”.
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Electrical and Thermal Characterizations of IGBT Module with Pressure-Free Large-Area Sintered Joints
… interconnection material for high-temperature power electronic packaging, such as high melting temperature, high electrical/thermal conductivity, and excellent mechanical reliability. It should be noted, however, that pressure (usually between three to five MPa) was added during the sintering …
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Thermal Stability of Al₂O₃/Silicone Composites as High-Temperature Encapsulants
Conventional microelectronic and power electronic packages based on Si devices usually work below 150°C. The emergence of wide-bandgap devices, which potentially operate above a junction temperature of 250°C, results in growing research interest in high-density and high-temperature packaging. There …