Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 203 for “"polishing"”.
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Electrolytic polishing of non-ferrous metals
Call number: LD2668 .T4 1951 M377
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Electrolytic polishing of non-ferrous metals
Call number: LD2668 .T4 1951 M377
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Laser foil printing and surface polishing processes
… of foil, laser cutting of foil, and laser polishing processes. The fabricated free-form parts were demonstrated and own better mechanical properties (micro hardness and tensile strength) than the raw material, because of the rapid-cooling process of laser welding. The full and strong bond …
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Bore polishing of diesel engine cylinder liners
… important omissions in the literature on bore polishing, firstly there is no evidence of the successful development of a reliable tribo test device to simulate bore polishing and secondly, the mechanism of bore polishing has not been fully defined. The aims of this study were: 1. To establish …
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Nano-scale scratching in chemical-mechanical polishing
During the chemical-mechanical polishing (CMP) process, a critical step in the manufacture of ultra-large-scale integrated (ULSI) semiconductor devices, undesirable nano-scale scratches are formed on the surfaces being polished. As the width of the interconnect Cu lines continues to shrink to below …
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Multi-scale scratching in chemical-mechanical polishing
… semiconductor devices, the chemical-mechanical polishing (CMP) process is extensively employed. During the CMP process, undesirable scratches are produced on Cu interconnects both by the abrasive particles in the slurry and by the softer pad asperities. In order to meet the stringent demands of …
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Analysis of slurry flow in chemical-mechanical polishing
Chemical-Mechanical Polishing (CMP) is one of the enabling processes used in the manufacture of semiconductor chips. In the relentless progress to make computer chips faster, smaller, and cheaper, the CMP process plays a prominent role. One of its limitations, however, is non-uniform polishing rate …
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Scratching by pad asperities in chemical mechanical polishing
… manufacturing process is chemical-mechanical polishing (CMP), which is used to create connecting metal channels above the transistors in a chip. A typical form of this process used in industry is metal CMP. Metal CMP is the process of using a pad combined with an abrasive slurry to remove …
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Modeling of chemical mechanical polishing for dielectric planarization
Chemical mechanical polishing (CMP) has emerged as the dielectric planarization method of choice since it can reduce topography over longer length scales than traditional techniques. However, CMP still suffers from large die-level layout pattern dependencies and process induced wafer-level …
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Flexible Media Polishing Machine for Ti-6Al-4V Components
… extreme surface finish requirements. Flexolap polishing offers a technique to achieve these requirements, and minimizes the disadvantages encountered by other polishing techniques. The aim of this dissertation is that of designing and developing a working Flexolap polishing machine (and …
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Modeling of chemical mechanical polishing for shallow trench isolation
Thesis (S.B. and M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2000.
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Modeling of chemical mechanical polishing using fixed abrasive technology
Chemical Mechanical Polishing (CMP) is conventionally carried out using abrasive slurry and a polishing pad. An alternative process is the "fixed abrasive" polish. Existing models, which accurately predict oxide thickness variations across a chip for the conventional CMP process, have not …
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Characterization and modeling of polysilicon MEMS chemical-mechanical polishing
… of integrated circuits, chemical-mechanical polishing (CMP) is becoming an enabling technology for microelectromechanical systems (MEMS). To reliably use CMP in the manufacturing process, designers must be able to accurately predict the CMP process and control final surface uniformity. This …
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Optical endpoint detection for the chemical mechanical polishing process
… the endpoint for the Chemical Mechanical Polishing process of copper wafers. The proposed mechanism will detect the reflectance difference found in semiconductor materials to trigger the stop of the polishing process. This will prevent over polishing of the wafer while ensuring the optimal …
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Modeling of chemical mechanical polishing for shallow trench isolation
This thesis presents the nonlinear analysis, design, fabrication, and testing of an axial-gap magnetic induction micro machine, which is a two-phase planar motor in which the rotor is suspended above the stator via mechanical springs, or tethers. The micro motor is fabricated from thick layers of …
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Characterization and modeling of uniformity in chemical mechanical polishing
Thesis (M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1999.
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Ice and abrasive particles : an alternative CMP polishing technique
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1998.
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Improving the polishing process for Rockwell hardness test block
… block manufacturing process were analyzed. The polishing stage was identified to be the bottleneck with a high reworking rate. An understanding based on the physics of polishing was the first step. Then a DOE analysis was implemented to find the optimum parameters of polishing process. A range …
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Axiomatic system design : chemical mechanical polishing machine case study
… study of the design of a machine tool system for polishing silicon wafers using chemical mechanical polishing (CMP) is presented. The CMP system architecture is decomposed from top level requirements using the principles of axiomatic design, and the theorems developed in this thesis. The CMP …
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