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Showing 1 to 2 of 2 for “"planar package"”.
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Design and Development of High Density High Temperature Power Module with Cooling System
… and at the same time, the standard Si device packages do not meet the requirement of high temperature operation. In order to take full advantage of SiC semiconductor devices, high density, high temperature device packaging needs to be developed. In this dissertation, a high temperature …
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Technology for Planar Power Semiconductor Devices Package with Improved Voltage Rating
… the electric field distribution in the package. The power semiconductor packaging is simulated by using Finite Element Analysis (FEA) software. The electric field distribution is known and the locations of high electric field concentration are identified. 2. Development of planar …