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Showing 1 to 1 of 1 for “"packaging - microwave circuits"”.

  1. Characterization of the crystallinity and mechanical properties of CTFE & CTFE copolymeric films as a function of cooling rate and the implications on adhesion

    … films are being used in the electronic packaging industry as insulating dielectric layers between microwave circuits. Since these films are semicrystalline and, in this application, are being used as hot melt adhesives, the cooling rate is an important processing variable, affecting the …

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