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Showing 1 to 20 of 1084 for “"packages"”.

  1. Rapid Prototyping Of Microfluidic Packages

    … and inlet / outlet in simplified steps. The packages developed from this process proved to be an effective solution for many applications.

    ucf

  2. Thermomechanical effects in electronic packages

    Thesis (Sc. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1994.

    mit Repository record for Thermomechanical effects in electronic packages (opens in a new tab)

  3. Investigating the Reproducbility of NPM packages

    … emergence of a large ecosystem of third-party packages available via the Node Package Manager (NPM) repository which contains over one million published packages and witnesses a billion daily downloads. Most of the developers download these pre-compiled published packages from the NPM …

    vt Repository record for Investigating the Reproducbility of NPM packages (opens in a new tab)

  4. Accelerometer calibration of shuttle-based experiment packages

    Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Aeronautics and Astronautics, 1991.

    mit Repository record for Accelerometer calibration of shuttle-based experiment packages (opens in a new tab)

  5. Thermal analysis of power hybrid microelectronic packages

    In this dissertation a simplified nondimensional approach for the thermal analysis of power hybrid circuits is presented. The new technique uses only the metallization and the substrate as layers and represents everything below the substrate by an external thermal resistance (expressed as an …

    vt Repository record for Thermal analysis of power hybrid microelectronic packages (opens in a new tab)

  6. Modeling and simulation of surface mount packages

    … and performance evaluation of plastic packages for surface mount devices. Of particular interest in this work are packages for use in the gigahertz range. In order to accurately model these packages, time and frequency domain measurements of two different packaged structures are …

    vt Repository record for Modeling and simulation of surface mount packages (opens in a new tab)

  7. Assembly Yield Model for Area Array Packages

    … assembly process. Assembly yields of area array packages are heavily dependent on design of the board as much as package and process parameters. The economics of IC technology is such that the maximization of yield rather than the optimization of performance has become the topic of prime …

    vt Repository record for Assembly Yield Model for Area Array Packages (opens in a new tab)

  8. Analysis of column interconnects for wafer level packages

    … Copper column (CuC) interconnect for wafer level packages. First, a simulation-based design optimization process was established based on ABAQUS and Minitab. This process integrated finite element simulation, design of experiment and numerical optimization, generating a systematic and efficient …

    nus Repository record for Analysis of column interconnects for wafer level packages (opens in a new tab)

  9. Broadband Macromodeling Techniques for Interconnects and Electronic Packages

    … macromodel for passive interconnect and packages. The physical characteristics of the structures such as stability, causality, and passivity are preserved during the model construction. Also, a new method is formulated based on vector-fitting method in z-domain. It has the advantage of …

    uiuc Repository record for Broadband Macromodeling Techniques for Interconnects and Electronic Packages (opens in a new tab)

  10. Thin-film trench capacitors for silicon and organic packages

    The continuous trend towards mega-functional, high-performance and ultra-miniaturized system has been driving the need for advances in novel materials with superior properties leading to thin components, high-density interconnect substrates and interconnections. Power supply and management is …

    gatech Repository record for Thin-film trench capacitors for silicon and organic packages (opens in a new tab)

  11. Design and Development of Distributed Lower Atmospheric Instrumentation Packages

    <p>The recent miniaturization of embedded electronics and widespread availability of low-cost sensors, microcontrollers and transceivers has enabled development of sensor suites that can be used for high temporal and spatial resolution measurements of atmospheric parameters such as temperature, …

    embry-riddle Repository record for Design and Development of Distributed Lower Atmospheric Instrumentation Packages (opens in a new tab)

  12. HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES

    Plastic-encapsulated packages are susceptible to moisture-induced cracking due to high moisture permeability of the typical epoxy molding compound. During solder reflow, the high temperature together with the previously absorbed moisture will result in high hygrothermal stresses at material …

    nus Repository record for HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES (opens in a new tab)

  13. Drop Impact Reliability Testing Lead-Free Chip Scale Packages

    … thesis discusses the reliability of Chip Scale Packages (CSPs) in drop impact, with and without the CSPs being edge-bonded, using two failure detection systems and presents the component failure sequence as observed by each system. To enable this study a high-speed data acquisition system, …

    calpoly Repository record for Drop Impact Reliability Testing Lead-Free Chip Scale Packages (opens in a new tab)

  14. The Use of Selected Learning Packages in Home Economics

    Made available in DSpace on 2014-12-12T19:53:49Z (GMT). No. of bitstreams: 1 7606991.pdf: 5737608 bytes, checksum: 2f3ac3ce7498e47709e88a2b6a120cd8 (MD5) Previous issue date: 1975

    uiuc Repository record for The Use of Selected Learning Packages in Home Economics (opens in a new tab)

  15. The Emotional Effects of Warning Labels on Nicotine Pouch Packages

    The aim of the study was to measure the emotional effects of warning images on nicotine pouches containers on users and non-users of nicotine pouches. If applicable, similar warning images might be used to affect people’s consumption of nicotine pouches. Participants observed five sets of warning …

    u-iceland Repository record for The Emotional Effects of Warning Labels on Nicotine Pouch Packages (opens in a new tab)

  16. Late Quaternary Mississippi River Incised Valley Fill: Transgressive Depositional Packages

    <p>A series of USACE atlas quadrangles and dee pborings from the USGS and LGS with radiocarbon dated peats were used to construct several regional crosssections and paleogeographic reconstructions. Late Pleistocene glaciation and consequent lowered sea leve lresulted in reentrenchment of the …

    uno Repository record for Late Quaternary Mississippi River Incised Valley Fill: Transgressive Depositional Packages (opens in a new tab)

  17. Software packages performance evaluation of basic radar signal processing techniques

    … goal is to determine if any open source scripted packages are appropriate for radar signal processing and if it is worthwhile purchasing the more expensive MATLAB, commonly used in industry. Some of the most common radar signal processing techniques were considered, such as pulse compression, …

    cape-town Repository record for Software packages performance evaluation of basic radar signal processing techniques (opens in a new tab)

  18. Fatigue crack propagation along polymer-metal interfaces in microelectronic packages

    Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.

    mit Repository record for Fatigue crack propagation along polymer-metal interfaces in microelectronic packages (opens in a new tab)

  19. Workflow Evaluation of Key Work Packages in Drug Product Technologies

    … dynamically as the processes within work packages evolve. By evaluating work packages at these three levels, we build the case for extending these processes throughout DPT in other studies and using these tools to inform systematic decision-making around investments potentially creating …

    mit Repository record for Workflow Evaluation of Key Work Packages in Drug Product Technologies (opens in a new tab)

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