Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 4 of 4 for “"package parasitics"”.
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Modeling and simulation of surface mount packages
… and performance evaluation of plastic packages for surface mount devices. Of particular interest in this work are packages for use in the gigahertz range. In order to accurately model these packages, time and frequency domain measurements of two different packaged structures are …
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Multi-resonant passive components for power conversion
… industry. Prominent among these obstacles are package parasitics and heat, which have come to the fore as conventional circuits are applied in modern regimes of frequency and integration density. To an ever increasing extent, integration limits are symptoms of the fundamental frequency- and …
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SiGe BiCMOS RF ICs and Components for High Speed Wireless Data Networks
… over multi-chip solutions, such as reductions of parasitics, size, power consumption, and bill-of-materials; however, a number of critical challenges must be considered in the integration of such SoC solutions. The focus of this research is the application of SiGe BiCMOS technology to on-going …
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Impact of Device Parametric Tolerances on Current Sharing Behavior of a SiC Half-Bridge Power Module
This paper describes the design, fabrication, and testing of a 1.2 kV, 6.5 mΩ, half-bridge, SiC MOSFET power module to evaluate the impact of parametric device tolerances on electrical and thermal performance. Paralleling power devices increases current handling capability for the same bus voltage. …