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Showing 1 to 1 of 1 for “"package inductance"”.
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In-situ impedance characterization for assessing SiC MOSFETs reliability
… into its sub-components: on-state resistance and package inductance. Accelerated aging experiments confirm that on-state resistance correlates with gate-oxide degradation, while bond-wire lift-off leads to a measurable increase in package inductance. The circuit is thus capable of simultaneously …