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Showing 1 to 1 of 1 for “"nanosilver sintering"”.

  1. Die-Attachment on Copper by Nanosilver Sintering: Processing, Characterization and Reliability

    … performance of the power electronics packages. Nanosilver sintering has becoming an emerging solder-free, environmental friendly die-attach technology. Researchers have demonstrated the feasibility of die-attachment on silver (Ag) or gold (Au) surfaces by pressure-less or low-pressure (< 5 MPa) …

    vt Repository record for Die-Attachment on Copper by Nanosilver Sintering: Processing, Characterization and Reliability (opens in a new tab)