Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
Results
Showing 1 to 9 of 9 for “"multichip module"”.
-
Models for Yield Estimation of Multichip Module Ceramic Substrates
We present improved yield models that can be used for a broader range of printed patterns. We also enhance the defect geometry models that are commonly used today. We introduce a defect geometry model that is based on the physical process of defect formation. Our defect geometry model employs …
-
Electrical characterization of a multilayer low temperature co-fireable ceramic multichip module
… this research is to develop an understanding of Multichip Modules, (MCMs), more specific those fabricated with a Low Temperature Co-fireable Ceramic (L TCC) tape systems. The study will consist of designing, processing, and testing two generic MCM test patterns. The effects on signal propagation …
-
Design and fabrication of an underwater digital signal processor multichip module on low temperature cofired ceramic
An Underwater Digital Signal Processor (UDSP) multichip module (MCM) was designed and fabricated according to specifications outlined by the Naval Surface Warfare Center (NSWC), Dahlgren Division. Specifications indicated that low temperature cofired ceramic (L TCC) technology be used to fabricate …
-
Design of a high quality factor spiral inductors in RF MCM-D
… are fabricated in the Draper Laboratory, Inc. Multichip Module-Deposited (MCM-D) process. Simulated characteristics of the devices are verified using experimental measurements, and deviations from predicted performance are discussed.
-
The development of a nonvolatile ferroelectric memory with nondestructive readout
… board prototypes to a fully custom CMOS part. A multichip module (MCM) was employed to integrate the CMOS technology with a ferroelectric technology. This thesis develops several models for the behavior of ferroelectrics, examines how ferroelectric memory compares to the more mainstream …
-
Integrated optoelectronics applications in fiber optic receiver packaging
… above components is introduced and evaluated. Multichip module (MCM) technology has become the new standard in the field of electronic packaging. Much of the success of MCM packaging may be attributed to the development of LTCC systems. LTCC materials utilize their multilayer (3-dimensional) …
-
Physical Design for Multichip Modules
… deals with four physical design problems in the multichip module (MCM) environment: interconnect analysis, chip placement, global tree construction, and layer assignment. The emphasis is on maximizing the electrical performance, based on accurate modeling of MCM interconnect behavior. A new …
-
Defect correction based domain decomposition methods for some nonlinear problems
… The first problem is a heat conduction in a multichip module where there the domain is assembled from many components of different conductivities and physical sizes. Here the implementations of the schemes satisfy the component meshing and gluing concept. A finite difference approximation of …
-
Flip Chip testing with a capacitive coupled probe chip.
… reference for explorations of systems design for multichip modules (MCMs). This work focused on the chip testing aspect of area array I/O chips used in an MCM. Other work investigated partitioning, routing, and other system design issues. Finally, the work gives an outline of the CAD tool setup …