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Showing 1 to 2 of 2 for “"monolithic packaging"”.
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Immersion cooling and monolithic packaging for the thermal management of high-power density electronics
Submission published under a 24 month embargo labeled 'Closed Access', the embargo will last until 2024-12-01
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Design, Fabrication and Testing of Conformal, Localized Wafer-level Packaging for RF MEMS Devices
A low-cost, low-temperature packaging concept is proposed for localized sealing and control of the ambient of a device cavity appropriate for Radio-Frequency (RF) Micro- Electro-Mechanical (MEMS) devices, such as resonators and switches. These devices require application specific packaging to …