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Showing 1 to 5 of 5 for “"module fabrication"”.

  1. Multifaceted Codesign for an Ultra High-Density, Double-Sided Cooled Traction Inverter Half Bridge Module

    … is an increasingly popular choice in inverter module fabrication for electric vehicle applications owing to its inherent characteristics such as reduced on resistance, higher blocking voltage, and higher temperature stability that enable high power density, increased efficiency, and speeds. …

    vt Repository record for Multifaceted Codesign for an Ultra High-Density, Double-Sided Cooled Traction Inverter Half Bridge Module (opens in a new tab)

  2. Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules

    … and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented …

    vt Repository record for Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules (opens in a new tab)

  3. Electrical Integration of SiC Power Devices for High-Power-Density Applications

    … A Power Electronics Building Block (PEBB) module is then developed with discrete SiC MOSFETs. Integrating the power stage together with the peripheral functions such as gate drive and protection, the PEBB concept allows the converter to be built quickly and reliably by simply connecting …

    vt Repository record for Electrical Integration of SiC Power Devices for High-Power-Density Applications (opens in a new tab)

  4. Packaging and Magnetic Integration for Reliable Switching of Paralleled SiC MOSFETs

    … and manufacturability. For a SiC power module with current rating higher than 100 A, high did/dt and dvds/dt could possibly cause cross-turn-on (crosstalk-induced turn-on) through the gate-to-drain capacitance Cgd of the MOSFET dies and the package inductances. Mismatches in threshold …

    vt Repository record for Packaging and Magnetic Integration for Reliable Switching of Paralleled SiC MOSFETs (opens in a new tab)

  5. Development of Bi-Directional Module using Wafer-Bonded Chips

    Double-sided module exhibits electrical and thermal characteristics that are superior to wire-bonded counterpart. Such structure, however, induces more than twice the thermo-mechanical stress in a single-layer structure. Compressive posts have been developed and integrated into the double-sided …

    vt Repository record for Development of Bi-Directional Module using Wafer-Bonded Chips (opens in a new tab)