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Showing 1 to 2 of 2 for “"module characterization"”.
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Throughput Constrained and Area Optimized Dataflow Synthesis for FPGAs
… meets the throughput requirement. The second is module selection, which decides the most appropriate circuit module for each operation. The third is resource sharing, which reuses a circuit module by sharing it between multiple operations. This work shows that combining module selection and …
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Development of Bi-Directional Module using Wafer-Bonded Chips
Double-sided module exhibits electrical and thermal characteristics that are superior to wire-bonded counterpart. Such structure, however, induces more than twice the thermo-mechanical stress in a single-layer structure. Compressive posts have been developed and integrated into the double-sided …