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Showing 1 to 10 of 10 for “"low-k-dielectric"”.

  1. Electrical studies of silicon and low K dielectric material

    … powerful characterization technique that allows one to explore electrical and physical properties of defects in bulk and interface of electronic materials. Capacitance-Voltage (CV) measures the overall net carrier concentration and a built-in voltage for a diode junction. Deep level …

    mit Repository record for Electrical studies of silicon and low K dielectric material (opens in a new tab)

  2. ULTRA-LOW K DIELECTRIC MATERIALS WITH HIGH BREAKDOWN STRENGTH AND EXCELLENT MECHANICAL PROPERTIES

    … As electronic devices move to further scales lower in size, the problems associated with fabrication become more ubiquitous. This thesis focuses on Covalent organic frameworks, a recently discovered two-dimensional polymer as a promising material for low permittivity material and its …

    houston Repository record for ULTRA-LOW K DIELECTRIC MATERIALS WITH HIGH BREAKDOWN STRENGTH AND EXCELLENT MECHANICAL PROPERTIES (opens in a new tab)

  3. Resistive Switching Behavior in Low-K Dielectric Compatible with CMOS Back End Process

    In an effort to lower interconnect time delays and power dissipation in highly integrated logic and memory nanoelectronic products, numerous changes in the materials and processes utilized to fabricate the interconnect have been made in the past decade. Chief among these changes has been the …

    vt Repository record for Resistive Switching Behavior in Low-K Dielectric Compatible with CMOS Back End Process (opens in a new tab)

  4. Study of Interactions Between Diffusion Barrier Layers and Low-k Dielectric Materials for Copper/Low-k Integration

    The shift to the Cu/low-k interconnect scheme requires the development of diffusion barrier/adhesion promoter materials that provide excellent performance in preventing the diffusion and intermixing of Cu into the adjacent dielectrics. The integration of Cu with low-k materials may decrease RC …

    unt Repository record for Study of Interactions Between Diffusion Barrier Layers and Low-k Dielectric Materials for Copper/Low-k Integration (opens in a new tab)

  5. Thermal Transport on the Nanometer Scale and the Effect of Microstructure and Interface Resistance

    … W/B multilayers. The thermal conductivities of low-k dielectric thin films were measured with the 3o method between 80 and 400 K. The strong temperature dependence is not reflected by the minimum thermal conductivity model for homogeneous materials. The differential effective medium model …

    uiuc Repository record for Thermal Transport on the Nanometer Scale and the Effect of Microstructure and Interface Resistance (opens in a new tab)

  6. Scaling and process effect on electromigration reliability for Cu/low k interconnects

    … replacing aluminum (Al) by copper (Cu) and oxide dielectric by low-k dielectric. Electromigration (EM) turned out to be a serious reliability problem for Cu interconnects due to the implementation of mechanically weaker low-k dielectrics. In addition, line width and via size scaling resulted in …

    texas Repository record for Scaling and process effect on electromigration reliability for Cu/low k interconnects (opens in a new tab)

  7. Design of Aromatic Thermosetting Copolyester Compositions and Blends for Thin Film Applications

    … thin films display sharp improvements in their dielectric properties. Two thin film applications have been investigated. One, because foaming can reduce the dielectric constant, the possibility of foaming ATSP using the reaction byproduct during curing is an attractive concept in developing ATSP …

    uiuc Repository record for Design of Aromatic Thermosetting Copolyester Compositions and Blends for Thin Film Applications (opens in a new tab)

  8. Transparent Tissues and Porous Thin Films: A Brillouin Light Scattering Study

    … of transparent tissues within the eye as well as dielectric thin films of interest to the semiconductor industry.</p><p>As the human eye ages, focusing on a near object generally becomes difficult - a condition known as presbyopia. An age related stiffening of lens mechanical properties has been …

    ohiolink Repository record for Transparent Tissues and Porous Thin Films: A Brillouin Light Scattering Study (opens in a new tab)

  9. Applications for nanomaterials in critical technologies

    … thermal stability. This new system provides a low cost alternative to PFPE along with improved adhesion to the substrates. In addition, it displays a much lower viscosity, which may be of importance to stiction related problems. The synthetic route is readily scalable in case additional …

    uiuc Repository record for Applications for nanomaterials in critical technologies (opens in a new tab)

  10. Template-controlled integration and characterization of bottom-up grown ferroelectric nanoislands

    … are likewise employed due to their outstanding dielectric, piezoelectric and pyroelectric properties. The prospective success of any of these technologies will first and foremost depend on their potential to fulfill the markets requirement for ever growing integration densities. The scalability …

    aachen Repository record for Template-controlled integration and characterization of bottom-up grown ferroelectric nanoislands (opens in a new tab)