Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 9 of 9 for “"low-k dielectrics"”.
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Resistive Switching in Porous Low-k Dielectrics
Integrating nanometer-sized pores into low-k ILD films is one of the approaches to lower the RC signal delay and thus help sustain the continued scaling of microelectronic devices. While increasing porosity of porous dielectrics lowers the dielectric constant (k), it also creates many reliability …
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Chemical vapor deposition of organosilicon composite thin films for porous low-k dielectrics
… thin films with the potential use as low dielectric constant interconnect materials in microelectronic circuits. Both diethylsilane and octamethylcyclotetrasiloxane precursors were used, with oxygen and hydrogen peroxides oxidants respectively, to deposit low-k organosilicon films. …
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Characterization of optical interconnects
… deep sub-micron technology. Even with copper and low-k dielectrics, parasitic effects of interconnects will eventually impede advances in integrated electronics. One technique that has the potential to provide a paradigm shift is optics. This project evaluates the feasibility of optical …
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Mechanics, mechanisms, and modeling of the chemical mechanical polishing process
… excellent local and global planarization at low cost. It is thus widely adopted for planarizing inter-level dielectric (silicon dioxide) layers. Moreover, CMP is a critical process for fabricating the Cu damascene patterns, low-k dielectrics, and shallow isolated trenches. The wide range of …
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Evaluation of unsaturated fluorocarbons for dielectric Etch applications
… silicon dioxide films, but also on new low-k dielectrics that are likely candidates for future generation process flows. Emissions and process performance are reported for each of the different gases. The prospects for integration of some of these chemistries to next generation processes …
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ULTRA-LOW K DIELECTRIC MATERIALS WITH HIGH BREAKDOWN STRENGTH AND EXCELLENT MECHANICAL PROPERTIES
… As electronic devices move to further scales lower in size, the problems associated with fabrication become more ubiquitous. This thesis focuses on Covalent organic frameworks, a recently discovered two-dimensional polymer as a promising material for low permittivity material and its …
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Scratching by pad asperities in chemical mechanical polishing
… the increase in resistance, the use of low dielectric constant (k) materials in place of SiO₂ has been explored. Low-k dielectrics are much softer than SiO₂, which has led to problems with scratching of the Cu during CMP, resulting in faulty parts. Recent research by Thor Eusner …
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Scaling and process effect on electromigration reliability for Cu/low k interconnects
… (Al) by copper (Cu) and oxide dielectric by low-k dielectric. Electromigration (EM) turned out to be a serious reliability problem for Cu interconnects due to the implementation of mechanically weaker low-k dielectrics. In addition, line width and via size scaling resulted in the need of a …
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Applications for nanomaterials in critical technologies
… thermal stability. This new system provides a low cost alternative to PFPE along with improved adhesion to the substrates. In addition, it displays a much lower viscosity, which may be of importance to stiction related problems. The synthetic route is readily scalable in case additional …