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Showing 1 to 1 of 1 for “"low-k applications"”.
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Hydrophobic, fluorinated silica xerogel for low-k applications.
… materials for future integrated circuit applications due to their low dielectric constant and high mechanical properties (i.e., Young's modulus (E) and hardness (H)). Co-condensing with TEFS, linear structures from DMDES hydrolysis and condensation reactions rendered hybrid films …