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Showing 1 to 13 of 13 for “"low temperature co-fired ceramic"”.
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Manufacturing operation modeling for product redesign : resistance analysis of low-temperature co-fired ceramic circuits
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1995.
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A Low Temperature Co-fired Ceramic (LTCC) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module
… of this dissertation research is to develop a low temperature co-fired ceramic (LTCC) interposer-based module-level 3-D wire bondless stacked power module. As part of the dissertation work, the 3-D wire bondless stack is designed, simulated, fabricated and characterized. The 3-D wire bondless …
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Measuring Characteristic Shrinkage Variability Due to Metal Loading Effects in Low Temperature Co-Fired Ceramic Using Image Processing
<p>Low temperature co-fired ceramic (LTCC) has many benefits when it comes to electronic packaging due to the low dielectric loss, reliability in extreme environments, and high breakdown voltage. Though the ceramic has a lot of benefits it is not widely used due to the high cost and complexities …
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Synthesis and Design of Microwave Wideband Filters and Components
In the development of modern communication systems, various stringent requirements are imposed on the hardware components to support emerging applications. There is broad interest in developing wideband microwave passive components that enable the successful building and integration of wideband …
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Processing to Enable Direct-Write Additive Manufacturing of Ceramics and Ceramic Composites
… specifically the direct ink writing (DIW) and Ceramic On-Demand Extrusion (CODE) manufacturing processes, in order to produce ceramic and ceramic-based composite components. Strongly dispersed, concentrated (φ = 0.42), nanoparticle (d<sub>50</sub> ~0.3 µm), zirconia (ZrO<sub>2</sub>) pastes …
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High Frequency LTCC based Planar Transformer
… power and higher frequency related technology, conventional wire-wound magnetics have their own limitations which has led path to the development of planar based magnetic materials. Nowadays more planar magnetic technology has been employed because it is easier to fabricate them. The planar …
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Superdirectivity and the Application of Complementary Split Ring Resonators in Directivity Enhancement of Millimeter-Wave Antennas
… losses, millimeter wave antennas suffer from low radiation performance. Motivated by this limitation, this work investigates superdirectivity for millimeter wave antenna designs. Superdirectivity happens when a radiating body exceeds its maximum theoretical directivity limit. Based on a …
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Design and Assembly of High-Temperature Signal Conditioning System on LTCC with Silicon Carbide CMOS Circuits
… is to develop a prototype electronic module on a low-temperature co-fired ceramic (LTCC) material. The electronic module would perform signal conditioning of sensor signals (thermocouples) operating under extreme conditions for applications like gas turbines to collect data on the health of the …
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Fabrication and Characterization of Miniaturized Components Based on Extruded Ceramic-Filled Polymer Blends
… manufacturing process for microstructured ceramic components that is based on co-extrusion. Co-extrusion of structured feedrods holds promise for development of multi-layered, functionally graded and/or textured structures. However, it requires a polymer binder that is difficult to remove …
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A Double-Sided Stack Low-Inductance Wire-Bondless SiC Power Module with a Ceramic Interposer
… (3-D) wire bondless power module package for silicon carbide (SiC) power devices to achieve a low parasitic inductance and an improved thermal performance. A half-bridge module consisting of 900-V SiC MOSFETs is realized to minimize stray parasitic inductance as well as to provide both vertical …
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Packaging of a High Power Density Point of Load Converter
… for today's microprocessors, point of load converter packaging is becoming an important issue. Traditional thermal management techniques involved in removing heat from a printed circuit board are being tested as today's technologies require small footprint and volume from all electrical …
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Uniform Field Distribution Using Distributed Magnetic Structure
Energy distribution in a conventional magnetic component is generally not at a designer's disposal. In a conventional toroidal inductor, the energy density is inversely proportional to the square of the radius. Thus, a designer would be unable to prescribe uniform field distribution to fully …
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Low-Profile Magnetic Integration for High-Frequency Point-of-Load Converter
… is also known as a high current Point-of-Load converter (POL). These circuits are mostly constructed using discrete components, and populated on the motherboard. With this solution, the passive components such as inductors and capacitors are bulky. They occupy a considerable footprint on the …