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Showing 1 to 5 of 5 for “"laser spallation"”.

  1. Interfacial adhesion of thin film high energy density anode materials

    … adhesion strength through the technique of laser spallation (LS) combined with finite element analysis (FEA). It was found that the Ni/a-Si interface can withstand at least ~250 MPa in tension before failure is initiated. Tests at higher stress levels were inconclusive due to consistent …

    uiuc Repository record for Interfacial adhesion of thin film high energy density anode materials (opens in a new tab)

  2. Mechanochemical activation at solid interfaces

    … are prepared by surface modification. A modified laser spallation setup and finite element scheme are used to analyze energy evolution during dynamic delamination process. The interfacial fracture toughness of the SAM-modified Si-Au interface increases by 86% with the increase in thiol …

    uiuc Repository record for Mechanochemical activation at solid interfaces (opens in a new tab)

  3. Molecular tailoring of interfaces for thin film on substrate systems

    … modifications on adhesion is assessed using a laser-spallation technique. Laser-induced stress waves are chosen because they dynamically load the thin film interface in a precise, non-contacting manner at high strain rates and are suitable for both weak and strong interfaces. Photodefinable …

    uiuc Repository record for Molecular tailoring of interfaces for thin film on substrate systems (opens in a new tab)

  4. Dynamic delamination of patterned thin films

    … interface. The testing method involves using a laser-induced acoustic stress wave to load the film/substrate fracture plane in tension at very high strain rate (~10^7/s) leading to the inertia-driven interface delamination. A weak adhesive layer is selectively introduced at the interface to …

    uiuc Repository record for Dynamic delamination of patterned thin films (opens in a new tab)

  5. Computational modeling of laser-induced delamination testing of thin films

    … that accurately and efficiently characterize it. Laser-induced delamination is a novel technique that uses laser-generated stress waves to load thin films at high strain rates and extract the fracture toughness of the film/substrate interface. The effectiveness of the technique in measuring the …

    uiuc Repository record for Computational modeling of laser-induced delamination testing of thin films (opens in a new tab)