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Showing 1 to 1 of 1 for “"intermetallic compound thickness"”.
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Modelling of solder interconnection’s performance in photovoltaic modules for reliability prediction
… results obtained from this study indicate that intermetallic compound thickness (TIMC); solder joint thickness (TSJ) and width (WSJ) have significant impacts on fatigue life of solder joint. The impacts of TIMC and TSJ are such that as the thicknesses increases solder joint fatigue life …