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Showing 1 to 20 of 24 for “"intermetallic compound"”.
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Grain boundary studies in ordered intermetallic compound Ni3 Al
Theoretical and experimental studies of grain boundary structures were carried out to understand the grain boundary properties of Ni₃Al. Using various techniques of transmission electron microscopy, the geometry of grain boundaries was determined from a number of grain boundaries to obtain a …
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Study of intermetallic compound layer formation, growth and evaluation of shear strength of lead-free solder joints
… solder joint reliability is the thickness of intermetallic compound (IMC) layer formed between the solder and the substrate. Although the formation of an IMC layer signifies good bonding between the solder and substrate, its main disadvantage is that it is also known to be the most brittle …
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ΜΕΛΕΤΗ ΔΙΑΧΥΤΙΚΗΣ ΑΝΑΠΤΥΞΗΣ ΤΗΣ ΔΙΑΜΕΤΑΛΛΙΚΗΣ ΦΑΣΗΣ FESN2 ΣΕ ΗΛΕΚΤΡΟΛΥΤΙΚΗ ΕΠΙΚΑΣΣΙΤΕΡΩΣΗ
… PRODUCTION ON DIFFUSION CONTROL GROWTH OF THE INTERMETALLIC COMPOUND FESN2 HAS BEEN INVESTIGATED. ANALYSIS OF THE DIFFUSION PROFILES AND MEASUREMENTS OF VOLUME DIFFUSION COEFFICIENTS SHOW THE DEPENDENCE OF THE DIFFUSION PROCESS FROM THE CONDITIONS OF THE SUBSTRATE CLEANING, THE …
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Towards mechanism-based constitutive modelling of L1₂ crystal plasticity
… plasticity model of the L12 structure intermetallic compound Ni3Al is developed, in light of recent theoretical developments and experimental evidence. Computational results show that the model is capable of predicting the major anomalous mechanical behaviors of L12 structures, …
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Effects of high energy mechanical milling on the kinetics of solid state reactions
… Cu/Al system, Cu(Al) solid solution or γ-Cu₉Al₄ intermetallic compound could form after the powder mixture was milled for up to 8 hours. Upon heating the powder mixtures milled for shorter times, γ-Cu₉Al₄ formed first in the powder with a nominal composition of Cu-14at%Al, and then, γ-Cu₉A₄ …
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A study of certain trace metals in sea water using anodic stripping voltammetry
… the determination of Zn through formation of an intermetallic compound, and further studies are indicated to understand this phenomenon. The anodic stripping apparatus was adapted and used conveniently on shipboard. It was demonstrated that stripping analysis could be combined with a method for …
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Numerical analysis of TSV/micro-bump deformation due to chip misalignment and thermal processing in 3D IC packages
… when the solder joint is transformed into an intermetallic compound is also examined. Misalignment induced shearing strongly influences stresses and deformation in and around the micro-bump. Thermal CTE mismatches influence stresses and deformation in the entire 3D chip stack and in the TSV …
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Atomic-scale and three-dimensional transmission electron microscopy of nanoparticle morphology
… the crystal- lographic status of novel intermetallic GaPd2 nanocatalysts and advancement of electron tomographic methods for high-fidelity three-dimensional analysis. Going beyond preceding analyses, high-resolution annular dark-field imaging is used to verify successful nano-sizing of …
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Modelling of solder interconnection’s performance in photovoltaic modules for reliability prediction
… results obtained from this study indicate that intermetallic compound thickness (TIMC); solder joint thickness (TSJ) and width (WSJ) have significant impacts on fatigue life of solder joint. The impacts of TIMC and TSJ are such that as the thicknesses increases solder joint fatigue life …
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Diffusion problems in lead-tin overlay bearings
… substrate results in the formation of copper-tin intermetallic compounds, consequently depleting tin in the overlay. This renders the bearing subject to corrosion in degraded oil. Attempts have been made to slow down this diffusion process by placing electro- deposited barriers between the bonding …
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Mechanisms of Deformation and Fracture in TiAl: An Atomistic Simulation Study
The intermetallic compound TiAl possesses a unique complex of properties that include sufficiently low material density, high values of the strength-to-ductility ratio, high elastic moduli, high oxidation resistance, low creep rate, and improved fatigue characteristics. These properties make TiAl …
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Surface plasmon resonance study of the purple gold (AuAl₂) intermetallic, pH-responsive fluorescence gold nanoparticles, and gold nanosphere assembly
… verified that the striking purple color of the intermetallic compound AuAl₂, also known as purple gold, originates from surface plasmons (SPs). This contrasts to a previous assumption that this color is due to an interband absorption transition. The existence of SPs was demonstrated by launching …
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The effect of alloying element in lead-free solders on intermetallics growth with enimag surface finish
… and 2000 hours at 150°C. The characteristics of intermetallic compound (IMC) were analyzed by using scanning electron microscopy (SEM), optical microscope (OM) and energy dispersive x-ray (EDX). The results revealed that there is one layer of (Cu,Ni)6Sn5 IMC was formed at the interface after …
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The effect of nitrogen, niobium and temperature of the high temperature oxidation of titanium aluminide alloys
… currently used materials. A model set of three intermetallics -- unalloyed [gamma]-TiAl, unalloyed [alpha]-Ti 3Al and a nearly stoichiometric Ti2NbAl (an orthorhombic intermetallic structure) -- was chosen and investigated under a variety of experimental conditions. Gas mixtures of varying …
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A study of certain trace metals in sea water using anodic stripping voltammetry
… the determination of Zn through formation of an intermetallic compound, and further studies are indicated to understand this phenomenon. The anodic stripping apparatus was adapted and used conveniently on shipboard. It was demonstrated that stripping analysis could be combined with a method for …
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Control of interface reactions in SiC/Ti composites and an X-ray diffraction study of interdiffusion between Al thin films and Ti substrates
… from alpha-Ti and diffraction lines from an intermetallic compound have been observed. For subsequent annealing times, the integrated intensities from the compound decreased slightly, indicating that the compound partially decomposed and released Al into the alpha-Ti lattice. This resulted in …
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An advanced perspective on twin growth in nickel-titanium
… NiTi that provides enhanced ductility in this intermetallic compound. The entire potential energy surface (PES) and mean energy path (MEP) during twinning is an outcome of our simulations, providing the needed insight to the atomistic processes. We suggest that the results provide a …
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A study of the thermomechanical reliability of solder joints in surface mount electronics technology
… occurring mostly at the boundary between Intermetallic Compound (IMC) layer and the solder bulk. From the results, the standoff height of a solder joint is adjustable as desired by a controlled variation of the bond pad diameter on the PCB. The standoff height of a solder joint is found to …
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Direct 3D and in situ characterization of light metal hydrides for hydrogen storage
… that the Ni catalyst is transformed into the intermetallic compound Mg2NiH4 with increasing milling duration, providing an explanation for the higher desorption temperatures with longer milling times. The dissolution of the Ni catalyst particles and conversion into Mg2Ni/Mg2NiH4 continued …
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Species Chemistry and Electrochemical Separation in Molten Fluoride Salt
… deposition potential of Ce by forming intermetallic compounds. It turned out only Ni electrode was feasible for preceding the deposition potential and the intermetallic compound was identified as CeNi5. The dissolution of chromium metal in the form of chromium fluoride into molten …
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