Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 12 of 12 for “"interfacial thermal resistance"”.
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Degradation and Breakdown of Ultrathin Gate Oxide
… that separates the soft and hard breakdown, thermal simulation is done using finite element analysis. The effects of interfacial thermal resistance and nanoscale heat conduction are included in the thermal model. The simulation results show that the diameter of leakage path is between 0.1 and …
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Molecular Dynamics Studies of Thin-Film Evaporation: The Effect of Graphene-Coated Silicon on Water Evaporation Behavior
… important to understand the relationship between interfacial thermal resistance, surface wettability, and thin-film evaporation behavior. In this study, non-equilibrium molecular dynamics simulations are used to study mass and heat transfer in thin-film evaporation of water on a silicon substrate, …
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Modeling nanoscale transport phenomena: Implications for the continuum
… In another case, we find that in the absence of interfacial effects, the stagnation flow produced by two opposing nanojets can be suitably described using continuum relations. We also examine heat conduction within solids of nanometer dimensions due to both the ballistic propagation of lattice …
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Development of hybrid inorganic/organic nanocomposites with enhanced thermal conductivity
Effective thermal management is a critical challenge across technologies such as microelectronics, automotive, and aerospace systems. In advanced electronics, continual miniaturization and rising power density intensify local heat generation; if heat is not removed and redistributed efficiently, …
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Transport modeling of simple fluids and nano-colloids : thermal conduction mechanisms and coarse projection
… dynamics (MD) simulations. The intrinsic thermal conductivity is decomposed into self and cross correlations of the three modes that make up the microscopic heat flux vector, namely, the kinetic, the potential and the virial. By this decomposition analysis, the interplay between the …
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Molecular Simulation Of Nanoscale Transport Phenomena
… is to characterize electric charge, mass and thermal transport at the nanoscale using a fundamental molecular simulation method, namely molecular dynamics. This dissertation reports simulations of (1) ion intake by carbon nanotubes, (2) hydrogen storage in carbon nanotubes, (3) carbon nanotube …
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Tunable organization of cellulose nanocrystals for controlled thermal and optical response
… for structural control and fine tuning of thermal and optical properties based on a proper understanding of their individual behavior and interactions at different length scales. In the present work, we attempt to provide an integral description of the influence of single crystals in the …
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IN-SITU ADDITIVE MANUFACTURING OF METALS FOR EMBEDDING PARTS COMPATIBLE WITH LIQUID METALS TO ENHANCE THERMAL PERFORMANCE OF AVIONICS FOR SPACECRAFT
… heat generation, requiring more reliable thermal management systems to enhance the thermal performance of the avionics. The emergence of advanced additive manufacturing (AM), such as selective laser melting (SLM) and engineering materials, such as low-melting eutectic liquid metal (LM) …
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Structural and thermal properties of graphene - boron nitride superlattice
… effect on fundamental properties (such as the thermal conductivity) is unknown and largely complicated by the ∼ 2% lattice mismatch between the two materials. This work provides an in-depth view of the possible interfacial structures in C-BN superlattices, and quantifies their effect on the …
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Sintering of Micro-scale and Nanscale Silver Paste for Power Semiconductor Devices Attachment
… properties including electrical conductivity, thermal conductivity, interfacial thermal resistance, and the shear strength of sintered silver joints, are significantly better than those of the reflowed solder layer. Given only twenty percent of small pores in the submicron range, the …
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Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules
… These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these …
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Investigation on fabrication, interface formation, and properties of hot-processed titanium-doped copper/diamond composites
Efficient thermal management is crucial for next-generation high-power electronic devices, driving the need for high-performance heat sink materials. Copper/diamond composites have emerged as promising candidates due to their exceptional thermal conductivity (TC) and tailorable coefficient of …