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Showing 1 to 9 of 9 for “"integrated power electronics module"”.

  1. Describing Integrated Power Electronics Modules using STEP AP210

    The software environment for power electronics design is comprised of tools that address many interrelated disciplines including circuits design, physical layout, thermal management, structural mechanics, and electromagnetics. This usually results in a number of separate models that provide various …

    vt Repository record for Describing Integrated Power Electronics Modules using STEP AP210 (opens in a new tab)

  2. RF Models for Active IPEMs

    Exploring RF models for an integrated power electronics module (IPEM) is crucial to analyzing and predicting its EMI performance. This thesis deals with the parasitics extraction approach for an active IPEM in a frequency range of 1MHz through 30MHz. Based on the classic electromagnetic field …

    vt Repository record for RF Models for Active IPEMs (opens in a new tab)

  3. Integrated Electrical and Thermal Modeling, Analysis and Design for IPEM

    … the multidisciplinary design process in power electronics through the integration of existing CAD tools, multidisciplinary modeling and system optimization. Two major benefits are expected from the utilization of the proposed integrated design methodology. Firstly, it will significantly …

    vt Repository record for Integrated Electrical and Thermal Modeling, Analysis and Design for IPEM (opens in a new tab)

  4. Integrated Thermal Design and Optimization Study for Active Integrated Power Electronic Modules (IPEMs)

    … is one of many critical tasks in the design of power electronic systems. It has become increasingly important as a result of the introduction of high power density and integrated modules. It has also been realized that higher temperatures do affect reliability due to a variety of physical …

    vt Repository record for Integrated Thermal Design and Optimization Study for Active Integrated Power Electronic Modules (IPEMs) (opens in a new tab)

  5. High Temperature SiC Embedded Chip Module (ECM) with Double-sided Metallization Structure

    … demonstrate a technology for a high temperature integrated power electronics module, for high temperature (e.g those over 200oC) applications involving high density and low stress. To achieve this goal, this study has examined some existing packaging approaches, such as wire-bond interconnects …

    vt Repository record for High Temperature SiC Embedded Chip Module (ECM) with Double-sided Metallization Structure (opens in a new tab)

  6. Investigation of High-density Integrated Solution for AC/DC Conversion of a Distributed Power System

    With the development of information technology, power management for telecom and computer applications become a large market for power supply industries. To meet the performance and reliability requirement, distributed power system (DPS) is widely adopted for telecom and computer systems, because …

    vt Repository record for Investigation of High-density Integrated Solution for AC/DC Conversion of a Distributed Power System (opens in a new tab)

  7. Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules

    … need for the introduction of high reliability power electronics in converting the raw form of electricity into efficient electricity for these applications is uprising. One of the most common failures in power electronics is temperature related failure such as overheating. To address the issue …

    vt Repository record for Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules (opens in a new tab)

  8. Electrical, Magnetic, Thermal Modeling and Analysis of a 5000A Solid-State Switch Module and Its Application as a DC Circuit Breaker

    … The mechanical circuit breaker is widely used in power systems to protect industrial equipment during fault or abnormal conditions. Compared with the slow and high-maintenance mechanical circuit breaker, the solid-state circuit breaker is capable of high-speed interruption of high currents without …

    vt Repository record for Electrical, Magnetic, Thermal Modeling and Analysis of a 5000A Solid-State Switch Module and Its Application as a DC Circuit Breaker (opens in a new tab)

  9. Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips

    Circuit assembly and packaging technologies for power electronics have not kept pace with those for digital electronics. Inside those packaged power devices as well as the state-of-the-art power modules, interconnection of power chips is accomplished with wirebonds. Wirebonds in power devices and …

    vt Repository record for Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips (opens in a new tab)