Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 5 of 5 for “"integrated cooling"”.
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Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules
… presented the IPEM approach by introducing integrated power electronics modules (IPEM) as standardized units that will enable greater integration within power electronics systems and their end-use application. The IPEM approach increases the integration in the components that make up a power …
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Investigation into the optimal cooling configuration for a gas turbine airfoil utilizing a thermal barrier coating
The overall cooling effectiveness of a gas turbine airfoil characterizes the conjugate effect of both film cooling and internal cooling on an airfoil in one parameter. Few studies in open literature have explored the overall cooling effectiveness of airfoil's utilizing a thermal barrier coating. In …
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Data center cooling using Aquifer Thermal Energy Storage (ATES)
… and nearly 40% of their demand comes from cooling alone, underscoring the need for more energy-efficient and sustainable cooling methods. This thesis develops a comparative techno- economic framework to evaluate two advanced cooling strategies. Magnetic bearing chillers (MBC) and MBC + …
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Sub-nanosecond Cherenkov photon detection for LHCb particle identification in high-occupancy conditions and semiconductor tracking for muon scattering tomography
… A high-precision mechanical structure with integrated cooling is built to align the SCT modules. This alignment is fine-tuned in software, and the tracker performance is compared with a Geant4 simulation. A scattering angle resolution compatible with 1.5 mrad at the 4 GeV average cosmic-ray …
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Thermal designs, models and optimization for three-dimensional integrated circuits
Three-dimensional integrated circuits (3D ICs), a novel packaging technology, are heavily studied to enable improved performance with denser packaging and reduced interconnects. Despite numerous advantages, thermal management is the biggest bottleneck to expanding the applications of this device …