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Showing 1 to 20 of 65 for “"integrated circuits (ICs)"”.

  1. System and IC level analysis of electrostatic discharge (ESD) and electrical fast transient (EFT) immunity and associated coupling mechanisms

    "The exposure of electronic circuits to lightning, electrostatic discharge (ESD), electrical fast transients (EFT) or sine wave signals can reveal RF immunity problems. Typical problems include temporary malfunctions or permanent damage of integrated circuits (ICs). In an effort to reproduce those …

    must-thes Repository record for System and IC level analysis of electrostatic discharge (ESD) and electrical fast transient (EFT) immunity and associated coupling mechanisms (opens in a new tab)

  2. Full chip modeling for predictive simulation of charged device model electrostatic discharge events

    With downscaling of device dimensions in integrated circuits (ICs), the risk of circuit failure due to electrostatic discharge (ESD) is increasing. In particular, the increased usage of automated handlers is causing charged device model (CDM) ESD induced failures to become more prominent. Gate …

    uiuc Repository record for Full chip modeling for predictive simulation of charged device model electrostatic discharge events (opens in a new tab)

  3. An automated bench testing system for direct current parameters of instrumentation amplifiers

    … at multiple stages in the production of analog integrated circuits (ICs). An efficient system for low-volume IC testing is one that automates bench tests and provides good measurement precision and accuracy, while costing far less than the standard automated test equipment (ATE) used for …

    mit Repository record for An automated bench testing system for direct current parameters of instrumentation amplifiers (opens in a new tab)

  4. Extracting secret keys from integrated circuits

    … delay variation of wires and transistors across integrated circuits (ICs) in the manufacturing processes to build a secret key unique to each IC. We fabricated Arbiter-based PUFs in custom silicon and investigated the identification based PUFs in custom silicon and investigated the identification …

    mit Repository record for Extracting secret keys from integrated circuits (opens in a new tab)

  5. Asynchronous Circuit Stacking for Simplified Power Management

    <p>As digital integrated circuits (ICs) continue to increase in complexity, new challenges arise for designers. Complex ICs are often designed by incorporating multiple power domains therefore requiring multiple voltage converters to produce the corresponding supply voltages. These converters not …

    arkansas Repository record for Asynchronous Circuit Stacking for Simplified Power Management (opens in a new tab)

  6. Overcoming nanoscale variations through statistical error compensation

    … high-performance, next-generation digital integrated circuits (ICs). Conventional design principles impose increased design margins in power supply, device sizing, and operating frequency, leading to overly conservative designs which prevent the realization of potential benefits from …

    uiuc Repository record for Overcoming nanoscale variations through statistical error compensation (opens in a new tab)

  7. Characterization and modeling of plasma etch pattern dependencies in integrated circuits

    … pattern dependent effects in plasma etching of integrated circuits (ICs) is presented. Plasma etching is a key process for pattern formation in IC manufacturing. Unfortunately, pattern dependent non-uniformities arise in plasma etching due to microloading and RIE lag. This thesis contributes a …

    mit Repository record for Characterization and modeling of plasma etch pattern dependencies in integrated circuits (opens in a new tab)

  8. Numerical analysis of TSV/micro-bump deformation due to chip misalignment and thermal processing in 3D IC packages

    Three-dimensional (3D) stacking of integrated circuits (ICs) is an enabling technology in the advancement of the microelectronics industry. 3D stacking enables increased device density per volume and improved electrical performance through short vertical interconnect paths. Mechanical reliability …

    unm Repository record for Numerical analysis of TSV/micro-bump deformation due to chip misalignment and thermal processing in 3D IC packages (opens in a new tab)

  9. Integrating graphene Hall sensors with co-designed silicon circuits for high-throughput magnetic biosensing

    … constrain the performance of silicon integrated circuits (ICs) and their use in emerging applications. Next-generation devices with exceptional performance and new functionalities have been realized using two-dimensional materials such as graphene. For example, graphene Hall-effect …

    penn Repository record for Integrating graphene Hall sensors with co-designed silicon circuits for high-throughput magnetic biosensing (opens in a new tab)

  10. A Silicon Carbide Power Management Solution for High Temperature Applications

    … their potential is contingent upon developing integrated circuits (ICs) capable of operating in similar environments. </p> <p>The foundation of any electrical system is the ability to efficiently condition and supply power. The work presented in this thesis explores integrated SiC power …

    arkansas Repository record for A Silicon Carbide Power Management Solution for High Temperature Applications (opens in a new tab)

  11. Multiphysics modeling and simulation for large-scale integrated circuits

    … problems related to the design of modern integrated circuits (ICs): the ever increasing couplings among the multiphysics and the large problem size arising from the escalating complexity of the designs. A multiphysics-based computer-aided design methodology is proposed and realized to …

    uiuc Repository record for Multiphysics modeling and simulation for large-scale integrated circuits (opens in a new tab)

  12. Determining the Preston constants of low-dielectric-constant polymers

    An important step in the manufacture of integrated circuits (ICs) is the Chemical Mechanical Polishing (CMP) process. In order to effectively use CMP, the removal rates of the materials used in ICs must be known. The removal rate of a given material by CMP can be determined once its Preston …

    mit Repository record for Determining the Preston constants of low-dielectric-constant polymers (opens in a new tab)

  13. An Improved dipole-moment model based on near-field scanning for characterizing near-field coupling and far-field radiation from an IC

    … platform design. The accurate noise model of integrated circuits (ICs) is needed to help designers to diagnose and predict RFI problems. In this dissertation, an improved IC radiated emission model based on near-field measurements is proposed. The regularization technique and the truncated SVD …

    must-thes Repository record for An Improved dipole-moment model based on near-field scanning for characterizing near-field coupling and far-field radiation from an IC (opens in a new tab)

  14. Electrode arrays, test fixture, and system concept for high-bandwidth capacitive imaging

    … leading source of failure in the fabrication of integrated circuits (ICs). Thus, the IC industry inspects for defects at multiple stages of IC fabrication, especially the fabrication of IC photomasks. However, existing non-invasive imaging methods cannot image a modern photomask in a reasonable …

    mit Repository record for Electrode arrays, test fixture, and system concept for high-bandwidth capacitive imaging (opens in a new tab)

  15. Nanoengineered surfaces for advanced thermal management

    … for a variety of applications including integrated circuits (ICs) and energy conversion devices. As the heat fluxes exceed 100 W/cm2, novel cooling solutions need to be developed. Thin film evaporation is a promising approach because the large latent heat associated with phase change can …

    mit Repository record for Nanoengineered surfaces for advanced thermal management (opens in a new tab)

  16. The Dual Use of Power Distribution Networks for Data Communications in High Speed Integrated Circuits

    … a new data communication method in high speed integrated circuits using power distribution networks (PDNs). The conventional purpose of PDNs in integrated circuits (ICs) is to deliver power to internal nodes of an IC while meeting a level of power integrity. As the power consumption increases …

    vt Repository record for The Dual Use of Power Distribution Networks for Data Communications in High Speed Integrated Circuits (opens in a new tab)

  17. A Statistical and Circuit Based Technique for Counterfeit Detection in Existing ICs

    Counterfeit Integrated Circuits (ICs) are previously used ICs that are resold as new. They have become a serious problem in modern electronic devices. They cause lower performance, reduced life span and even catastrophic failure of systems and platforms. To prevent counterfeiting and the associated …

    vt Repository record for A Statistical and Circuit Based Technique for Counterfeit Detection in Existing ICs (opens in a new tab)

  18. Chemistry, Detection, and Control of Metals during Silicon Processing

    … and metal contaminants during manufacturing of integrated circuits (ICs) on silicon wafers. Chapter 1 begins with an overview of IC manufacturing, including discussion of the common aqueous cleaning solutions, metallization processes, and analytical techniques that will be investigated in …

    unt Repository record for Chemistry, Detection, and Control of Metals during Silicon Processing (opens in a new tab)

  19. EMI measurement and modeling techniques for complex electronic circuits and modules

    … (including counterfeit) and aging effects in integrated circuits (ICs) based on measuring the complex reflection coefficient of an IC when illuminated with an open-ended rectangular waveguide probe, at K-band (18-26.5 GHz) and Ka-band (26.5-40 GHz) microwave frequencies.</p> <p>In the fourth …

    must-thes Repository record for EMI measurement and modeling techniques for complex electronic circuits and modules (opens in a new tab)

  20. A gate array chip set as a fault-tolerant bus interface unit based on nubus protocols

    … board, and therefore bus interface unit (BIU) integrated circuits (ICs) play an important role in the design of new boards. Spaceborn systems must be fault-tolerant due to their high susceptibility to transient faults and the high costs of repair and maintenance. Hence, a gate array …

    vt Repository record for A gate array chip set as a fault-tolerant bus interface unit based on nubus protocols (opens in a new tab)

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