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Showing 1 to 7 of 7 for “"high speed interconnects"”.

  1. Crosstalk mitigation of high-speed interconnects using modal signaling

    Today's high-speed I/O signaling links are faced with difficult challenges: due to manufacturing and technology limitations, the resources (pins and interconnects) available for off-chip signaling remain almost constant, while the throughput needed is increasing and the required aggregate …

    uiuc Repository record for Crosstalk mitigation of high-speed interconnects using modal signaling (opens in a new tab)

  2. Efficient and physically consistent electromagnetic macromodeling of high-speed interconnects exhibiting geometric uncertainties

    … responses of linear, passive, multiport, high-speed interconnect networks. First, we propose and demonstrate a new methodology that combines the efficiency of low-frequency and high-frequency resistance and inductance extraction for electrically-short interconnects using …

    uiuc Repository record for Efficient and physically consistent electromagnetic macromodeling of high-speed interconnects exhibiting geometric uncertainties (opens in a new tab)

  3. Thick film Y₁Ba₂Cu₃Ox on buffered ceramic substrates

    High Temperature Superconductors (HTS) materials are ideal for many electrical applications. These applications include high speed interconnects, microwave structures and transmission lines, as well as electronic devices that utilize the unique electrical and magnetic properties of these materials. …

    vt Repository record for Thick film Y₁Ba₂Cu₃Ox on buffered ceramic substrates (opens in a new tab)

  4. A fast multi-purpose circuit simulator using the latency insertion method

    With the increase in the density of interconnects and the complexity of high-speed packages, signal integrity becomes an important aspect in the design of modern devices. Circuit designers are constantly in need of robust circuit simulation methods that are able to capture the complicated …

    uiuc Repository record for A fast multi-purpose circuit simulator using the latency insertion method (opens in a new tab)

  5. Thermal design and solutions for handling heat loads in high-speed connectors for data centers

    … growth of data transmission and power density in high-speed interconnects such as OSFP (Octal Small Form-Factor Pluggable) and QSFP (Quad Small Form-Factor Pluggable) modules have made thermal management a critical design challenge. Although liquid cooling has emerged as a high-capacity …

    uiuc Repository record for Thermal design and solutions for handling heat loads in high-speed connectors for data centers (opens in a new tab)

  6. Systems and circuits for broadband contactless and wireline transceivers

    … the development of cost- and energy-efficient high-speed interconnects capable of managing the significant bandwidth demands of such applications. The most effective solution for transferring these large volumes of data is broadband wireline communication systems. They cover a wide range of …

    uiuc Repository record for Systems and circuits for broadband contactless and wireline transceivers (opens in a new tab)