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Showing 1 to 4 of 4 for “"high heat flux thermal management"”.

  1. Evaporation from nanoporous membranes for high heat flux thermal management

    Heat dissipation is a critical limitation in a range of electronic devices including microprocessors, solar cells, laser diodes and power amplifiers. The most demanding devices require dissipation of heat fluxes in excess of 1 kW/cm2 with heat transfer coefficients more than 30 W/cm 2K. Advanced …

    mit Repository record for Evaporation from nanoporous membranes for high heat flux thermal management (opens in a new tab)

  2. Thin-film evaporation from well-defined silicon micropillar wicks for high-heat-flux thermal management

    The generation of concentrated heat loads in advanced microprocessors, power amplifiers, and concentrated photovoltaics present significant thermal management challenge for defense, space and commercial applications. Liquid to vapor phase-change strategies are promising due to the high latent heat

    mit Repository record for Thin-film evaporation from well-defined silicon micropillar wicks for high-heat-flux thermal management (opens in a new tab)

  3. Developing an active, high-heat-flux thermal management strategy for power electronics via jumping-droplet phase-change cooling

    Mitigating heat generated by hot spots inside of power electronic devices is a formidable obstacle to further increases in power density. This work presents the first demonstration of active cooling for hot spots in compact electronics via electric-field-enhanced (EFE) jumping-droplet condensation. …

    uiuc Repository record for Developing an active, high-heat-flux thermal management strategy for power electronics via jumping-droplet phase-change cooling (opens in a new tab)

  4. Prediction and mitigation strategies for the transient thermal performance of low thermal resistance microchannel evaporators

    Microchannel flow boiling heat transfer offers an effective thermal management solution for high heat flux microelectronic devices such as laser diodes. The high heat transfer rates, nearly isothermal flow conditions, high surface area-to-volume ratios, and lower required pumping powers facilitate …

    colostate Repository record for Prediction and mitigation strategies for the transient thermal performance of low thermal resistance microchannel evaporators (opens in a new tab)