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Showing 1 to 7 of 7 for “"high heat flux applications"”.
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Fatigue and Fracture Behavior of High Strength and High Conductivity Copper Alloys for High Heat Flux Applications
The fatigue performance of CuAl25 and CuCrZr and OFHC copper was also evaluated under creep-fatigue loading conditions. It was found that creep and stress relaxation have a major impact on fatigue behavior. Fatigue lives were reduced notably with hold time even at room temperature. Hold times are …
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The Effects of Temperature on Fracture Behavior and Fracture Mechanisms of Copper Alloys for High Heat flux Applications
Made available in DSpace on 2017-07-06T18:55:08Z (GMT). No. of bitstreams: 3 Li_Meimei_MS.pdf: 41567594 bytes, checksum: dce44a7ecbfc865b1e4d3aea199d02ad (MD5) Li_Meimei_MS_ABS.pdf: 1028268 bytes, checksum: 3958467b416638279ef210f1b6cb352b (MD5) license.txt: 4813 bytes, checksum: …
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Mechanical Properties and Microstructure of Copper Alloys and Copper Alloy-Stainless Steel Laminates for Fusion Reactor High Heat Flux Applications
A solid plate of CuAl25 alloy hot isostatically pressed to a 316L stainless steel plate showed the best overall mechanical properties of the studied bi-metallic bonded panels. Bond properties were nominally inferior to constituent bulk material properties and fracture toughness values, in …
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Fabrication of Three-Dimensionally Independent Microchannels Using a Single Mask Aimed at On-Chip Microprocessor Cooling
… variety of channel sizes that can be fabricated. High values of flow rate, coil power, and pressure were found to produce this effect. The capability of the modeled process for creating a microchip cooling device for high-heat flux applications was also investigated. Using meander channels, heat …
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Manufacturing and analysis of a LIGA heat exchanger for the surface of a tube: a cooling simulation of the leading edge region of a turbine blade
Fabricating nickel micro heat exchangers directly on planar or non-planar metal surfaces has been demonstrated using the LIGA micromachining process. These heat exchangers can effectively control the temperature of surfaces in high heat flux applications. Of particular interest is the temperature …
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Flow Boiling in Meso-Scale Pin-Fin Coldplates
… are a critical component in various cooling applications, such as cooling of data centers, high-end central processing units (CPUs) and graphics processing units (GPUs), and the thermal management of power electronics. The rising demand for computational resources, high-power-density …
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Geometric and numerical optimisation of single- and two-phase convective heat transfer in microchannel heat sinks
… systems are required for the present and future high heat flux applications because natural and forced air convection and many other cooling methods employing liquid coolants cannot meet up with the challenges. More transistors are added to the surfaces of electronic chips to increase the …