Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 13 of 13 for “"high density integration"”.
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Substrate Integrated Waveguide Horn Slot Antenna Array
… is suggested for low-loss, low-cost and high density integration applications. SIW preserves the advantages from both the traditional rectangular waveguide and microstrip for easy integration. It is used in designing passive circuits such as resonators, couplers, filters, power dividers, …
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Laser micromachining of active and passive photonic integrated circuits
… and writing on large areas of substrates at high speed following the exposure of laser light, without using complicated photomask steps. For passive photonic devices fabrication, a novel femtosecond laser with unprecedented low repetition rates of 4 MHz is demonstrated to generate high …
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Crosstalk and Signal Integrity in Ring Resonator Based Optical Add/Drop Multiplexers for Wavelength-Division-Multiplexing Networks
… architectures to become increasingly integrated. High density integration of optical components leads to potential ‘Optical/Photonic’ electromagnetic compatibility (EMC) and signal integrity (SI) issues due to the close proximity of optical components and waveguides. Optical EMC issues are due to …
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Device integration for silicon microphotonic platforms
Silicon ULSI compatible, high index contrast waveguides and devices provide high density integration for optical networking and on-chip optical interconnects. Four such waveguide systems were fabricated and analyzed: crystalline silicon-on-insulator (SOI) strip, polycrystalline silicon (polySi) …
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Characterization of process variability and robust optimization of analog circuits
… CMOS devices and has provided speed, power, and density improvement in both digital and analog circuits. CMOS millimeter-wave applications operating at more than 50GHz frequencies has become viable in sub-100nm CMOS technologies, providing advantages in cost and high density integration compared …
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Optimization of Bonding Geometry for a Planar Power Module to Minimize Thermal Impedance and Thermo-Mechanical Stress
… impedance and thermo-mechanical stress for high density integration of power electronics systems. With the development semiconductor technology, the heat flux generated in power device keeps increasing. As a result, more and more stringent requirements were imposed on the thermal and …
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Three-Dimensional Loss Effects of a Solenoidal Inductor with Distributed Gaps
… gaps. The simulated 3D structure possesses higher losses than its 2D cross-section due to inherent structural features. The research culminates in two contributions. First, a practical two-variable design approach is presented, leveraging matrix algebra to succinctly represent the decision …
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Insulation-Constrained Design of Power Electronics Converters and DC Circuit Breakers
… of this work. The combination of growing power density requirements and higher voltages can result in enhanced electric field (E-field) intensities, leaving the system vulnerable to partial discharges (PDs). The manifestation of such PD events gradually degrades the insulation system of the …
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Functional Oxides in Optical and Electronic Applications by Atmospheric Pressure Spatial Chemical Vapour Deposition
… of Things, RRAM is being developed to achieve high-density integration while being compatible with silicon-based technology. One prominent oxide, tungsten oxide, or WO3, stands out in academic research because it is CMOS-compatible and is a binary oxide making it easier to process. It has many …
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Design of High-Density Filter Building Blocks for SiC-based Three-Phase Power Converters
… MOSFETs has resulted in a paradigm shift toward high-density and high-efficiency integration of power electronics systems. This being the result of relatively high switching frequencies (>10 kHz) compared to conventional Si IGBT counterparts, which reportedly can minimize the size of passive …
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Development of Bi-Directional Module using Wafer-Bonded Chips
Double-sided module exhibits electrical and thermal characteristics that are superior to wire-bonded counterpart. Such structure, however, induces more than twice the thermo-mechanical stress in a single-layer structure. Compressive posts have been developed and integrated into the double-sided …
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High-Speed and Power Efficient Integrated Electro-Optic Modulators
… consumption and small footprints, which enable high-density integration at a low cost. The standard silicon-on-insulator (SOI) platform and the more recently developed lithium niobate-oninsulator (LNOI) platform are the foundations of photonic integrated circuits (PIC), which have emerged as a …
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Design, Optimization, and Integration of a SiC-Based Traction Inverter with Enhanced Current Sharing for Paralleled Discrete Devices
… inverters that spin the motor need to deliver high power, high efficiency, and high density. According to the U.S. Department of Energy (DOE) roadmap, the 2025 targets for traction inverters include achieving a power density of 100 kW/L, reducing inverter cost to $2.7/kW, reaching efficiency of …