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Showing 1 to 20 of 126 for “"heat sink"”.

  1. 2.672 experiment design : heat sink fin configurations

    … proposed experiment, students will optimize a heat sink for a certain type of rack-mount server. For a correct execution of the experiment, students will test the power dissipation of several different heat sinks against a model for how they should behave using principles of incompressible …

    mit Repository record for 2.672 experiment design : heat sink fin configurations (opens in a new tab)

  2. Reduced order optimization of internal channel heat sink designs

    Submission published under a 24 month embargo labeled 'U of I Access', the embargo will last until 2024-05-01

    uiuc Repository record for Reduced order optimization of internal channel heat sink designs (opens in a new tab)

  3. Air flow in a high aspect ratio heat sink

    The increasing heat output of modern electronics requires concomitant advances in heat sinking technology: reductions in thermal resistance and required pumping power are necessary. This research covers the development of a novel type of air-cooled heat sink, in particular the air flow through such …

    mit Repository record for Air flow in a high aspect ratio heat sink (opens in a new tab)

  4. Topology optimization methods for heat sink design applied to power electronics

    DSpace SAF Submission Ingestion Package generated from Vireo submission #14644 on 2020-02-28 at 17:14:41

    uiuc Repository record for Topology optimization methods for heat sink design applied to power electronics (opens in a new tab)

  5. Numerical Investigation of the Structural Integrity of Silicon Carbide and Copper Heat Sink

    Two simple heat sink designs, made from Silicon Carbide (SiC) and Copper, are created and examined numerically using ANSYS Fluent and Structural simulations assuming a Silicon (Si) heater. The heat sink geometry considers a conventional rectangular straight microchannel (RSMC) heat sink with the …

    uic

  6. Experimental Evaluation of an Additively Manufactured Straight Mini-Channel Heat Sink for Electronics Cooling

    … led to a significant growth in the density of heat dissipation within these devices. This increase in heat generation has challenged conventional air fan cooling and alternative solutions for heat removal are required to avoid overheating and part damage. Micro/Mini channel heat sinks (M/MCHS) …

    vt Repository record for Experimental Evaluation of an Additively Manufactured Straight Mini-Channel Heat Sink for Electronics Cooling (opens in a new tab)

  7. Analysis of Direct-Soldered Power Module / Heat Sink Thermal Interface for Electric Vehicle Applications

    … the thermal impedance between power module and heat sink is important for high-power density, low-cost inverter applications. Mounting a power module by directly soldering it onto a heat sink can significantly reduce the thermal impedance at the module / heat sink interface, as compared to the …

    vt Repository record for Analysis of Direct-Soldered Power Module / Heat Sink Thermal Interface for Electric Vehicle Applications (opens in a new tab)

  8. Comparison of heat sink and fan combinations and thermal electric coolers for use in the Mars Gravity Biosatellite

    … of time in reduced gravity. Because of a large heat shield needed for reentering the Earth's atmosphere, the payload module is nearly perfectly insulated. It is therefore necessary to actively transport heat out of the capsule and radiate it off into space. A thermal electric cooler and a heat

    mit Repository record for Comparison of heat sink and fan combinations and thermal electric coolers for use in the Mars Gravity Biosatellite (opens in a new tab)

  9. Experimental Investigation of the Effect of Copper Nanowires On Heat Transfer and Pressure Drop For A Single Phase Microchannel Heat Sink

    <p>This thesis experimentally investigates the heat transfer and pressure drop characteristics of a shallow rectangular single phase microchannel heat sink with hydraulic diameter of 0.672 mm and whose bottom wall is coated with Cu nanowires (CuNWs) of 200 nm in diameter and 0.050 mm in length. …

    south-carolina Repository record for Experimental Investigation of the Effect of Copper Nanowires On Heat Transfer and Pressure Drop For A Single Phase Microchannel Heat Sink (opens in a new tab)

  10. Investigating the trade-offs involved in augmenting a DC brushless motor with an active heat sink in order to improve performance.

    … solutions to the issue of electric motor heating and the problems it presents for use of these motors in biomechatronic applications. As electric motors are used, their windings heat up and the resulting temperature limits torque. Larger motors may be used to obtain more torque, but this …

    mit Repository record for Investigating the trade-offs involved in augmenting a DC brushless motor with an active heat sink in order to improve performance. (opens in a new tab)

  11. Experimental Evaluation of Innovative Thermal Energy Storage Options for a Hypersonic Non-Airbreathing Vehicle's Internal Loads

    … vehicle is particularly difficult. The heat generated by the power electronics, avionics, etc. must be removed so that the components do not exceed their maximum temperatures. These vehicles cannot dump the waste heat into fuel or ram air because they carry no fuel and do not have …

    vt Repository record for Experimental Evaluation of Innovative Thermal Energy Storage Options for a Hypersonic Non-Airbreathing Vehicle's Internal Loads (opens in a new tab)

  12. Design and experimental testing of metamaterial-based agitators

    Due to the low heat rejection capacity or huge water consumption of traditional cooling methods, many power plants are looking for a way that is eco-friendly and high efficient but low-cost to retrofit their current cooling system. This study aims to explore innovative solutions to enhance heat

    missouri Repository record for Design and experimental testing of metamaterial-based agitators (opens in a new tab)

  13. A piezoelectric translational flow agitator for active air cooling of electronics.

    As heat dissipation from electronic components dramatically increases due to the rapid development of integrated circuits with micro-nano fabrication, the need increases for powerful cooling facilities. Different cooling schemes such as liquid cooling, direct sprays, boiling heat transfer, etc. …

    umn Repository record for A piezoelectric translational flow agitator for active air cooling of electronics. (opens in a new tab)

  14. An Improved dipole-moment model based on near-field scanning for characterizing near-field coupling and far-field radiation from an IC

    … of this dipole model is the prediction of heat sink radiation. In order to accurately predict the fields excited by a heat sink, an approach is proposed in this paper to include the exact excitation of the heat sink, which is described by some dipole moments constructed from the near-field …

    must-thes Repository record for An Improved dipole-moment model based on near-field scanning for characterizing near-field coupling and far-field radiation from an IC (opens in a new tab)

  15. Thermal Overload Capabilities of an Electric Motor and Inverter Unit Through Modeling Validated by Testing

    … and inverter are packaged in one unit with the heat sink in the middle. The heat sink is a cold chamber designed to absorb the maximum heat losses from the unit. Empirical data was used to validate the model of the cold chamber and finalize the design. A lumped capacitance finite-difference …

    vt Repository record for Thermal Overload Capabilities of an Electric Motor and Inverter Unit Through Modeling Validated by Testing (opens in a new tab)

  16. The development of a new compact model for prediction of forced flow behaviour in longitudinal fin heat sinks with tip bypass

    … the capacity to produce significant amounts of heat which, if not removed efficiently, could lead to component failure. The most common technique of heat removal is by making use of a heat spreader, or so¬-called heat sink. These devices are excellent heat conductors with a large surface area to …

    pretoria Repository record for The development of a new compact model for prediction of forced flow behaviour in longitudinal fin heat sinks with tip bypass (opens in a new tab)

  17. Non-intrusive two-phase flow regime identification and transport characterization in microchannels subject to uniform and non-uniform heat input

    <p>Direct integration of compact microchannel heat sinks is an attractive thermal management solution for the dissipation of high heat fluxes, specifically under boiling conditions that provide high rates of heat transfer at a uniform heat sink temperature. Under two-phase flow conditions, the heat

    purdue-thes Repository record for Non-intrusive two-phase flow regime identification and transport characterization in microchannels subject to uniform and non-uniform heat input (opens in a new tab)

  18. Forced Convection in Microchannels with Nanostructures on One Wall

    … and as a result, need to dissipate higher heat fluxes. Active cooling is the only possible method of thermal management for these devices. A new type of microchannel heat sink has been developed and evaluated in this study. The device consists of silicon microchannels on whose bottom …

    gatech Repository record for Forced Convection in Microchannels with Nanostructures on One Wall (opens in a new tab)

  19. Hybrid microfluidic cooling and thermal isolation technologies for 3D ICs

    … between through silicon via (TSV) parasitics and heat sink performance. A TSV-compatible micropin-fin heat sink is designed, fabricated and thermally characterized in a single tier, and benchmarked with a conventional air-cooled heat sink. The designed heat sink has a thermal resistance of 0.269 …

    gatech Repository record for Hybrid microfluidic cooling and thermal isolation technologies for 3D ICs (opens in a new tab)

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