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Showing 1 to 7 of 7 for “"four-point bend test"”.

  1. Damage accumulation of bovine bone under chaotic and variable amplitude loading.

    … The Moon's Beam experimental set-up was used to test chaotic loading conditions. The variable amplitude set-up was utilized to test variable amplitude loading conditions. Lastly, a four-point bend test was used to determine the baseline properties of the bone tissue. Scanning electron microscopy …

    baylor Repository record for Damage accumulation of bovine bone under chaotic and variable amplitude loading. (opens in a new tab)

  2. Characterization and requirements for Cu-Cu bonds for three-dimensional integrated circuits

    … quality under a range of loading conditions. The four-point bend test was used to quantify Cu-Cu bond toughness, Gc, under mixed-mode loading and to develop an optimized process flow that enabled the creation of high- toughness bonds (> 5 J/m2) at a bonding temperature of 300 oC. Mixed-mode …

    mit Repository record for Characterization and requirements for Cu-Cu bonds for three-dimensional integrated circuits (opens in a new tab)

  3. On the oxidation of high-temperature alloys, and its role in failure of thermal barrier coatings

    … at which crack initiation occurs in a notched four-point bend test experimentally studied in the literature, as well as the overall qualitative load-displacement behavior in this test.

    mit Repository record for On the oxidation of high-temperature alloys, and its role in failure of thermal barrier coatings (opens in a new tab)

  4. Characterization of bonded copper interconnects for three-dimensional integrated circuits

    … during processing and also during service. A four-point bend test technique has been used to evaluate the strength of Cu-Cu bonds. Test structures were fabricated by bonding wafers containing copper lines (with Ta barrier) that were patterned on silicon dioxide. Tests on the …

    mit Repository record for Characterization of bonded copper interconnects for three-dimensional integrated circuits (opens in a new tab)

  5. Supersonic Laser Deposition and LaserForge: Process Mechanism Coating Characteristics

    … scanning electron microscope. A tensile pull off test was used to measure the coating adhesion, and a four-point bend test with acoustic emission was used to monitor the failure of the coating. Plastic failure of the coating was identified, and a test limited adhesion strength in excess of 70 MPa …

    cambridge Repository record for Supersonic Laser Deposition and LaserForge: Process Mechanism Coating Characteristics (opens in a new tab)

  6. Dynamic delamination of patterned thin films

    … of the thin film/substrate interface. The testing method involves using a laser-induced acoustic stress wave to load the film/substrate fracture plane in tension at very high strain rate (~10^7/s) leading to the inertia-driven interface delamination. A weak adhesive layer is selectively …

    uiuc Repository record for Dynamic delamination of patterned thin films (opens in a new tab)

  7. Mechanical characterisation of float and laminated glass

    … strength of FG and LG when subjected to the four-point bend test (FPBT) and the ring-on-ring (ROR) test. This will aid in developing guidelines that account for size effects in structural design, ensuring safer and more reliable use of glass materials in engineering and architectural …

    cape-town Repository record for Mechanical characterisation of float and laminated glass (opens in a new tab)