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Showing 1 to 20 of 62 for “"flip chip"”.
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Underfill material selection for flip chip technology
… material for Digital Equipment Corporation's flip chip development project. Several tests were performed to determine the material properties, process properties, and the reliability of each underfill material. A material with a fast flow rate, uniform and void free flow pattern, fast curing …
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Study on the Nanocomposite Underfill for Flip-Chip Application
… underfill meeting the requirements of the chip package, it is necessary to have a fundamental understanding about the particle stability in the non-aqueous liquid and the relationship between materials properties and interphase structure in the composite. The results of this thesis …
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Mathematical and physical modeling of flip-chip soldering processes
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.
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Bewertung und Zuverlässigkeitsanalyse von Underfillmaterialien für die Flip-Chip-Technik
… entwickelt, der aus der Lagerung eines realen Flip-Chip-Aufbaus in einem Pressure-Cooker-Gefäß bei 121 °C und 100 % relativer Luftfeuchte und einer anschließenden mechanischen Beanspruchung durch Vibration bei Raumtemperatur besteht. Durch die definierte mechanische Beanspruchung im …
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Power Module with Series-connected MOSFETs in Flip-chip Configuration
… breakdown voltage) in series are assembled using flip-chip direct-bond technology. Three samples are assembled and the breakdown voltages are measured by using high-power curve tracer as 76 V, 82 V, and 72 V. The more accurate method for testing breakdown voltages by digital voltmeter obtains …
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UBM Formation on Single Die/Dice for Flip Chip Applications
… on aluminum pads of single die/dice for Flip Chip applications. The UBM (Under Bump Metallurgy) is required in solder bump structure to provide adhesion/diffusion barrier layer, solder wettable layer, and oxidation barrier layer between the bonding pads of the die and the bumps. …
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Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies
Flip chip interconnections have superior performance for microwave applications compared to wire bond interconnections because of their reduced parasitics, more compact architecture, and flexibility in laying out flip chip bond pads. Reduction in interconnect parasitics enables these interconnects …
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Modelling of the reliability of flip chip lead-free solder joints at high-temperature excursions
… the reliability of lead-free solder joints in a flip chip (FC) model FC48D6.3C457 which is mounted on a substrate and the assembly subjected to high-temperature excursions. The research investigates the effect of the high-temperature operations on reliability of the joints. In addition, the …
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SiGe receiver front ends and flip-chip integrated wideband antennas for millimeter-wave passive imaging
… A separate 77-GHz front end also features an on-chip 72-GHz cross-coupled VCO. The 77-GHz front end receiver achieves 46 dB max conversion gain, 6.5-10 dB noise figure (NF), output-referred 1dB compression point of +2 dBm and DC power dissipation (PDc) of 122 mW. The 94-GHz receiver achieves 47 …
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Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability
Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management; and, Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.
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Study of the time-dependent rheological behaviour of lead-free solder pastes and flux mediums used for flip-chip assembly applications
… of electronic devices for ultra-fine pitch and flip-chip applications requires the deposition of small and consistent paste deposits from pad to pad, and from board to board. The paste printing process at this chip-scale geometry depends on conditions such as good paste roll, complete aperture …
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A risk analysis methodology for micro/nano manufacturing
… the FIB sputtering process control, and (2) a flip chip design. Three different FIB processes using different ion sources were investigated in order to evaluate their process performance with respects to different process parameter uncertainties. A critical comparison of the process capability …
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Thermo-Mechanical Reliability and Electrical Performance of Indium Interconnects and Under Bump Metallization
… and Under Bump Metallization (UBM) in flip chip devices. Flip chip assemblies with the use of bump interconnections are frequently used, especially in high density, three-dimensional electronic devices. Currently there are many methods for interconnect bumping, all of which require UBM. …
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Analysis of terabit/second-class inter-chip parallel optoelectronic transceiver
… technologies developed for a novel inter-chip parallel optoelectronic (OE) transceiver (known as Terabus transceiver) which is able to communicate data at the speed in the range of Terabit/second. A novel packaging hierarchy and a creative design for an optical coupling mechanism devised …
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Structural Design and Optimization of 65nm Cu/low-k Flipchip Package
… out on some existing 15 mm x 15 mm die Cu/low-k flip chip packages which were identical to the 21 mm x 21 mm die package except for the size. The packages were found to pass the reliability tests. 2D plane strain finite element analyses were then performed on the 15 mm x 15 mm die. The computed …
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Through-Life Monitoring of the impact of vibration on the reliability of area array packages using Non- Destructive Testing
… evolved tremendously. Area array packages like flip chips and ball grid arrays are therefore widely used in modern day electronics. However, from the reliability standpoint, solder joints in these area array packages are often the weakest link. In case of harsh vibration environments like …
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Characterisation of lead-free solder pastes and their correlation with the stencil printing process performance
… electronic devices at the ultra-fine pitch and flip-chip geometry requires the deposition of small and consistent paste deposits from pad to pad and from board to board. The paste printing process at this chip-scale geometry depends on conditions such as good paste roll, complete aperture …
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