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Showing 1 to 1 of 1 for “"flexible Siliziumchips"”.
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Integration of ultrathin silicon chips
… connections between extremely thin chips and flexible substrates. Silicon test chips with thicknesses between 3.5 and 45 µm were fabricated using the Dicing-by-Thinning process (DbyT process). At the start of this process trenches are dry-etched into the front side of the silicon wafer along …