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Showing 1 to 1 of 1 for “"eutectic bonding"”.
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Design, Fabrication and Testing of Conformal, Localized Wafer-level Packaging for RF MEMS Devices
… Indium. This method offers a low-temperature bonding technique with thermal robustness suitable for wafer-level process integration. The ultimate goal is to create a seal in a vacuum environment. In this dissertation, design trade-offs made in wafer-level packaging are explained using …