Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 19 of 19 for “"encapsulant"”.
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Thermo-mechanical Analysis of a Custom PCB-DBC Hybrid Package for a (650 V, 150 A) e-GaN HEMT
… concepts of thermo-mechanical fatigue and using encapsulants to reduce it are established, along with how simulations are used to study said fatigue. Chapter 2 serves two purposes, the first being an explanation of the simulation settings and metrics used to establish the quality and assumptions …
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Encapsulation of electronic components for a retinal prosthesis
… electronics from a saline environment with an encapsulant material. Furthermore, the retinal implant project's proposed laser-driven prosthesis requires that the encapsulation material be transparent. The device itself has two components that must protrude out of the encapsulation material. The …
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Rapid Prototyping of a Directly Heated Thermionic Triode Using 3D Printing Techniques
… spot-welding techniques. Thick film silver and encapsulant materials were printed on a soda lime glass substrate to form the triode electrodes and ceramic wall bonding layer respectively. The anode was printed with a layer of silver, and the grid and cathode filament supports were soldered to …
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Mechanical design and analysis of implantable components for a retinal prosthesis
… were developed and used to test silicone as an encapsulant. In a 60 day soak test, all prosthesis models failed within three days, while completely encapsulated control models exhibited no current leakage. For the silicone application methods and implant materials currently being used, silicone …
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Evaluation and Application of Thermal Modeling for High Power Motor Improvements
… the model in both contact interfaces and winding encapsulant are evaluated, showing motor improvements in the ability to handle heat losses of approximately forty percent greater than the baseline, resulting in either higher power or lower motor temperatures for the same package size.
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SYNTHESIS OF POLYMER STRUCTURES FOR INCREASING ENERGY CONVERSION IN SOLAR CELLS
… method is to make a v-groove structure on the encapsulant, which is able to guide light to the absorption surface, rather than impinging on the metal contacts and being wasted. I have simulated the performance of isosceles triangles (IT), right triangles (RT), and metal-coated isosceles …
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Photostabilization of J-aggregate cyanine dyes for exciton-polariton based devices
… of the film with a hygroscopic sugar encapsulant. These results are highly promising and suggest future pathways for the realization of functional and stable polariton-based devices which we will explore in this thesis.
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Planar Packaging and Electrical Characterization of High Temperature SiC Power Electronic Devices
… solder ball and paste, adhesive epoxy, and encapsulant, were introduced and evaluated. The processes such as stencil printing, low-temperature sintering, solder reflowing, epoxy curing, sputtering deposition, electroplating, and patterning of direct-bond copper (DBC) were tightly controlled …
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Improvement in Adhesion for the Epoxy-SiC System via Plasma and Silane Surface Modification Techniques
The adhesion durability of coatings and encapsulant materials utilized in electronic packaging is vital for device reliability in the microelectronics industry. Due to adverse operating conditions such as high moisture and high temperature environments, the adhesion between an adhesive and its …
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Contracted phthalocyanine macrocycles: Conjugation with nanoparticles and the first synthesis of meso-substituted Boron SubTriBenzoDiAzaPorphyrin hybrids (SubTBDAPs)
… to quantum dots. The macromolecule was chosen as encapsulant due to its perfect curvature and interesting optical properties. CdSe quantum dots are well-known materials with size-dependent properties that makes them unique. Hence, some subphthalocyanines bearing functional groups with affinity for …
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Photophysical Properties of Emerging 2D Materials
… using a beeswax/PMMA layered structure. This encapsulant provides long-term protection against moisture and environmental degradation, allowing the devices to operate stably under water for extended durations. The encapsulated photodetectors are also demonstrated in turbidity sensing …
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Controlling Viscous Fingering
… for example through the slow release from encapsulant. We calculate the injection flow rate profile that minimises the final amplitude of instability in both rectilinear and axisymmetric geometries. In a development of the model, we repeat the calculation for a shear-thinning rheology. …
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Electro-Thermal Device-Package Co-Design for a High-Temperature Ultra-Wide-Bandgap Gallium-Oxide Power Module
… Furthermore, conventional polymeric and organic encapsulant materials are typically limited to operating temperatures of 200 °C and novel materials must be evaluated. This work outlines and evaluates an electro-thermal device-package co-design modeling platform that can be utilized for the …
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High Voltage Bias Testing And Degradation Analysis Of Photovoltaic Modules
… modules so as to avoid complication due to encapsulant creeping beneath the ribbons.
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Synthesis and Application of Ceramic Paste for High-Temperature Electronic Packaging
… cracks compared to similar commercial ceramic encapsulants. The die-attach material and encapsulation properties tested at 500°C showed no defect or additional cracks. Thermal aging and thermal cycling were carried out on the synthesized paste. XPS analysis revealed a higher oxygen bonding …
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Photoelectrochemical fuel synthesis using organic semiconductors with (bio)molecular catalysts
… (BHJ), protected by a carbon-based encapsulant to produce a range of solar fuels from H2 to syngas and formate. Starting from the rational design of organic photovoltaic (OPV) layers, conventional architecture devices based on the archetypal P3HT:fullerene BHJ were developed. The OPV …
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Encapsulación de Aceites Esenciales de Clavo para su Aplicación en la Industria Alimentaria
… is called shell, wall material, carrier or encapsulant. The development of microencapsulation products started in the 1950s with the research on pressure-sensitive coatings for the manufacture of carbonless copying paper (Green and Scheicher, 1955). Encapsulation technology is now well …
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Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips
… joint geometry, underfilling solder joint with encapsulant and applying flexible substrate in the assembly. The third objective is the implementation of solder joint interconnection technique in developing chip-scale power packages and a three-dimensional integrated power electronics module …
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Thermal Stability of Al₂O₃/Silicone Composites as High-Temperature Encapsulants
… There are high-temperature materials such as encapsulants on the market that are claimed for capability of continuous operation at or above 250°C. With an objective of identifying encapsulants suitable for packaging wide-bandgap devices, some of commercial high-temperature encapsulants were …